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公开(公告)号：EP4186877A8
公开(公告)日：2023-08-02
申请号：EP23151934.9
申请日：2019-06-10
申请人： Corning Incorporated
发明人： BOTU, Venkatesh , GUO, Xiaoju , KING, Ellen Anne , LAMBERSON, Lisa Ann , TANDIA, Adama , VARGHEESE, Kochuparambil Deenamma , WU, Jingshi
摘要： Substantially alkali free glasses are disclosed with can be used to produce substrates for flat panel display devices, e.g., active-matrix liquid crystal displays (AMLCDs). The glasses have high annealing temperatures and Young's modulus. Methods for producing substantially alkali free glasses using a downdraw process (e.g., a fusion process) are also disclosed.
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公开(公告)号：EP4186877A3
公开(公告)日：2023-08-23
申请号：EP23151934.9
申请日：2019-06-10
申请人： Corning Incorporated
发明人： BOTU, Venkatesh , GUO, Xiaoju , KING, Ellen Anne , LAMBERSON, Lisa Ann , TANDIA, Adama , VARGHEESE, Kochuparambil Deenamma , WU, Jingshi
摘要： Substantially alkali free glasses are disclosed with can be used to produce substrates for flat panel display devices, e.g., active-matrix liquid crystal displays (AMLCDs). The glasses have high annealing temperatures and Young's modulus. Methods for producing substantially alkali free glasses using a downdraw process (e.g., a fusion process) are also disclosed.
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公开(公告)号：EP3911612A1
公开(公告)日：2021-11-24
申请号：EP20741352.7
申请日：2020-01-16
申请人： Corning Incorporated
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5.发明公开STRENGTHENED GLASS SUBSTRATES WITH GLASS FRITS AND METHODS FOR MAKING THE SAME 审中-公开与玻璃芯片和方法强化玻璃基板及其制造
公开(公告)号：EP2844619A1
公开(公告)日：2015-03-11
申请号：EP13723621.2
申请日：2013-05-03
申请人： Corning Incorporated
IPC分类号： C03C3/16 , B60J1/00 , C03C3/19 , C03C3/21 , C03C8/02 , C03C8/04 , C03C8/08 , C03C17/04 , C03C21/00
摘要： Strengthened glass substrates with glass fits and methods for forming the same are disclosed. According to one embodiment, a method for forming a glass frit on a glass substrate may include providing a glass substrate comprising a compressive stress layer extending from a surface of the glass substrate into a thickness of the glass substrate, the compressive stress having a depth of layer DOL and an initial compressive stress CSi. A glass frit composition may be deposited on at least a portion of the surface of the glass substrate. Thereafter, the glass substrate and the glass frit composition are heated in a furnace to sinter the glass fit composition and bond the glass frit composition to the glass substrate, wherein, after heating, the glass substrate has a fired compressive stress CSf which is greater than or equal to 0.70*CSi.
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公开(公告)号：EP4426655A1
公开(公告)日：2024-09-11
申请号：EP22817451.2
申请日：2022-10-28
申请人： Corning Incorporated
CPC分类号： C03B19/09 , C03B1/00 , C03C11/005 , C03C3/097
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公开(公告)号：EP4186877A2
公开(公告)日：2023-05-31
申请号：EP23151934.9
申请日：2019-06-10
申请人： Corning Incorporated
发明人： BOTU, Venkatesh , GUO, Xiaoju , KING, Ellen Anne , LAMBERSON, Lisa Ann , TANDIA, Adama , VARGHEESE, Kochuparambil Deenamma , WU, Jingshi
摘要： Substantially alkali free glasses are disclosed with can be used to produce substrates for flat panel display devices, e.g., active-matrix liquid crystal displays (AMLCDs). The glasses have high annealing temperatures and Young's modulus. Methods for producing substantially alkali free glasses using a downdraw process (e.g., a fusion process) are also disclosed.
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公开(公告)号：EP3810558A1
公开(公告)日：2021-04-28
申请号：EP19733376.8
申请日：2019-06-10
申请人： Corning Incorporated
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公开(公告)号：EP2973699A1
公开(公告)日：2016-01-20
申请号：EP14721609.7
申请日：2014-03-13
申请人： Corning Incorporated
发明人： BORRELLI, Nicholas Francis , LAMBERSON, Lisa Ann , MORENA, Robert Michael , ORSLEY, Timothy James , TRUNTA, William Richard
IPC分类号： H01L25/075 , H01L33/64 , H01L33/50
CPC分类号： H01L25/0753 , H01L33/505 , H01L33/644 , H01L2224/48091 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths.
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