摘要:
Methods of forming a light emitting device package assembly include defining a chromaticity region in a two dimensional chromaticity space, and subdividing the defined chromaticity region into at least three chromaticity subregions, providing a plurality of light emitting devices that emit light having a chromaticity that falls within at least one of the defined chromaticity subregions, selecting at least three of the plurality of light emitting devices, each of the three light emitting devices emits light from a different one of the chromaticity subregions, and mounting the selected light emitting devices on a light emitting device package body.
摘要:
Methods are disclosed including applying a conformal coating to multiple light emitters. The conformal coating forms in gap areas between adjacent ones of the light emitters. The plurality of light emitters are separated into individual light emitters. The individual light emitters include the conformal coating that extends to a space corresponding to respective gap areas. Light emitting structures are disclosed including a semiconductor light emitting diode (LED) having an active region and a conformal coating including a first portion and a second portion, the first portion corresponding to at least one surface of the LED and the second portion extending from the first portion.
摘要:
Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described.
摘要:
Lighting apparatus (10) having a first lens (30) over the LED emitter (20) and a second lens (40) over the first lens, and including: a first optical surface (31) which is a first-lens outer surface (32) configured to refract light from the emitter; a second optical surface (50) which is a second-lens inner surface (41) spaced from the first optical surface; and a third optical surface (43) which is a second-lens outer surface (42) configured to refract light from the second optical surface toward a preferential side (2). One embodiment includes asymmetric primary and secondary lenses.
摘要:
Methods of packaging a semiconductor light emitting device in a reflector having a moat positioned between a lower and an upper sidewall thereof, the upper and lower sidewall defining a reflective cavity, include dispensing encapsulant material into the reflective cavity including the light emitting device therein to cover the light emitting device and to form a convex meniscus of encapsulant material in the reflective cavity extending from an edge of the moat without contacting the upper sidewall of the reflector. The encapsulant material in the reflective cavity is cured. Packaged semiconductor light emitting devices and reflectors for the same are also provided.