摘要:
To provide a cover tape capable of sufficiently suppressing corrosion of metal portions of electronic components even when the electronic components are stored in a high temperature high humidity environment for a long period of time, and a carrier tape system for packaging electronic components, whereby when the cover tape is peeled, a proper peeling strength can be constantly obtained. A cover tape comprising at least a substrate layer and a heat sealing layer, wherein (1) an antistatic layer containing an antistatic agent and an anticorrosive agent, is formed on the heat sealing layer, or (2) the heat sealing layer side has an average surface roughness (Ra) of from 0.3 to 1.0 µm, and has an antistatic agent applied thereon to form an antistatic layer.
摘要:
A cover tape is provided for sufficiently suppressing corrosion of a metal part of an electronic component, even when the electronic component is stored in a high temperature and high moisture environment for a long period of time, and a carrier tape system for packing the electronic component is provided for stably obtaining a suitable peeling strength at the time of peeling the cover tape. The cover tape is provided with at least a base layer and a heat seal layer, and has; (1) an antistatic layer, which includes an antistatic agent and an antirust, and is formed on the surface of the heat seal layer, or (2) an average surface roughness (Ra) of 0.3-1.0μm on the seat seal layer side, and has an antistatic layer whereupon an antistatic agent is applied on the surface.