METHOD AND APPARATUS FOR SCRIBING AND/OR BREAKING SEMICONDUCTOR WAFERS
    1.
    发明公开
    METHOD AND APPARATUS FOR SCRIBING AND/OR BREAKING SEMICONDUCTOR WAFERS 失效
    方法和设备书记和/或破坏半导体板

    公开(公告)号:EP0740598A4

    公开(公告)日:1997-04-23

    申请号:EP95907448

    申请日:1995-01-12

    发明人: TURNER JAMES R

    IPC分类号: B26F3/00 B28D5/00

    摘要: Apparatus for automatic scribing and breaking of semiconductor wafers wherein scribing is performed at a scribing station (S) and the scribed wafer transported in the X direction to a breaking station (B) on an X-Y table (3, 9). Scribing and breaking of parallel lines is accomplished by transporting the wafer step-wise in the Y direction by the Y table (3). Rotation of the wafer for scribing and breaking along sets of lines perpendicular to one another is accomplished by a theta table (18) carried on the Y table (3). An impulse bar (28) is carried by the X table (9) for applying force to the bottom surface of the wafer during both scribing and breaking. Scribing and breaking parameters needed to scribe and break the wafer are entered into computer memory and operated upon by computer controls to automate the scribing and/or breaking process.