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公开(公告)号：EP4318570A1
公开(公告)日：2024-02-07
申请号：EP22780173.5
申请日：2022-03-17
发明人： NAKAJIMA, Yuki
摘要： A technique for dissipating heat from a plurality of components is proposed. An electric component (1) includes a substrate (400), a first component (412), a second component (401), and a heat sink (31). The substrate (400) has a first surface (400b) and a second surface (400a) opposite to the first surface (400b). The first component (412) is disposed on a side of the first surface (400b). The second component (401) includes a body (401a) disposed on a side of the second surface (400a), and a lead (401b) that extends from the body (401a) through the second surface (400a) to the first surface (400b). The heat sink (31) is disposed on the side of the first surface (400b), and is used in common for dissipation of heat from the body (401a) through the lead (401b) and dissipation of heat from the first component (412) .
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公开(公告)号：EP4408131A1
公开(公告)日：2024-07-31
申请号：EP22876208.4
申请日：2022-09-27
摘要： A second substrate (20) is connected to a first substrate (10). A first chip part (11) has a strain equal to or more than a predetermined value which is from 500 µST to 4000 µST inclusive in a non-connected state where the second substrate (20) is not connected to the first substrate (10) and the first substrate (10) is supported at two predetermined points (30a, 30b), and the strain of the first chip part (11) is equal to or less than the predetermined value in a connected state where the second substrate (20) is connected to the first substrate (10) and the first substrate (10) is supported at the two predetermined points (30a, 30b).
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