公开(公告)号：EP4398151A3

公开(公告)日：2024-09-11

申请号：EP24177742.4

申请日：2021-06-02

申请人： Datamars SA

发明人： Luca, CEREA ,  Julien, BUROS

IPC分类号： G06K19/02 ,  G06K19/077

CPC分类号： G06K19/027 ,  G06K19/07728 ,  G06K19/0775

摘要： A method for manufacturing a tag for fabric is described. The tag comprises a radio module (1) with an ultra high transmission frequency (UHF), a radiofrequency identification integrated circuit (RFID IC) (2) connected to the UHF module (1), an antenna (3), and a substrate (4), and comprises mounting the UHF radio module (1) and the RFID integrated circuit (2) on the substrate (4), these being already electrically connected by means of metal tracks, and mounting the antenna (3) on the substrate (4); the method is characterized by applying a protective coating (5) on the UHF radio module (1) and on the RFID integrated circuit (2), which comprises coating the metal tracks for electrical connection between the RFID integrated circuit (2) and the UHF radio module (1) and, furthermore, coating a surface portion of the substrate (4) situated around the UHF radio module (1) and the RFID integrated circuit (2).

公开(公告)号：EP4398151A2

公开(公告)日：2024-07-10

申请号：EP24177742.4

申请日：2021-06-02

申请人： Datamars SA

发明人： Luca, CEREA ,  Julien, BUROS

IPC分类号： G06K19/077

CPC分类号： G06K19/027 ,  G06K19/07728 ,  G06K19/0775

摘要： A method for manufacturing a tag for fabric is described. The tag comprises a radio module (1) with an ultra high transmission frequency (UHF), a radiofrequency identification integrated circuit (RFID IC) (2) connected to the UHF module (1), an antenna (3), and a substrate (4), and comprises mounting the UHF radio module (1) and the RFID integrated circuit (2) on the substrate (4), these being already electrically connected by means of metal tracks, and mounting the antenna (3) on the substrate (4); the method is characterized by applying a protective coating (5) on the UHF radio module (1) and on the RFID integrated circuit (2), which comprises coating the metal tracks for electrical connection between the RFID integrated circuit (2) and the UHF radio module (1) and, furthermore, coating a surface portion of the substrate (4) situated around the UHF radio module (1) and the RFID integrated circuit (2).