公开(公告)号：EP1073322A1

公开(公告)日：2001-01-31

申请号：EP00202328.1

申请日：2000-07-03

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Manesh K.

IPC: H05K3/30 ,  H05K3/34

CPC classification number: H05K3/303 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/09909 ,  H05K2201/10568 ,  H05K2201/10636 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of improving the life expectancy of surface mount components (10) in electronic assemblies wherein a distance between the printed circuit board and the surface mount component is held to a predetermined distance defined as the stand-off height (16). The relationship between the stand-off height (16) and the life expectancy of the component is directly proportional. A larger stand-off height (16) translates into a longer life expectancy. The stand-off height (16) is limited only by manufacturing constraints, such as process limitations and cost concerns. The stand-off height (16) is set to a predetermined dimension by way of a spacer (28) positioned between the surface mount component (10) and the printed circuit board (12).

Abstract translation: 一种改善电子组件中的表面安装部件（10）的预期寿命的方法，其中印刷电路板和表面安装部件之间的距离被保持为限定为支座高度（16）的预定距离。 间隔高度（16）与部件的预期寿命之间的关系是直接成正比的。 更大的间隔高度（16）转化为更长的预期寿命。 对立高度（16）仅受制造限制，例如过程限制和成本问题的限制。 通过位于表面安装部件（10）和印刷电路板（12）之间的间隔件（28）将间隔高度（16）设定为预定尺寸。