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公开(公告)号：EP3537475A1
公开(公告)日：2019-09-11
申请号：EP19160791.0
申请日：2019-03-05
发明人： HONG, Shouyu , CHENG, Wei , ZHOU, Ganyu , ZOU, Xin , ZHAO, Zhenqing
IPC分类号： H01L21/48 , H01L23/373
摘要： The invention provides a power module and a production method of the same, wherein a metal substrate 9 is connected with a connection substrate 5 at a high temperature, and in a process of cooling from a high temperature to a low temperature, an upper surface and a lower surface of the metal substrate are bendingly deformed toward the connection substrate, and the upper surface of the metal substrate is formed as a curved surface protruding toward the connection substrate, then the lower surface of the metal substrate is processed into a plane. In the power module and the production method of the invention, the second bonding material 7 between the metal substrate and the connection substrate has a larger edge thickness, which reduces the thermal stress that the edge of the second bonding material is subject to, thereby improving the reliability of the power module while the power module has good heat dissipation performance.
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公开(公告)号：EP3598489A1
公开(公告)日：2020-01-22
申请号：EP19180703.1
申请日：2019-06-17
发明人： HONG, Shouyu , XU, Haibin , CHENG, Wei , CHENG, Juan , WANG, Tao , ZHAO, Zhenqing
摘要： A power module structure includes a first metal layer (41), a second metal layer (42), a third metal layer (43) and a fourth metal layer (44), wherein the fourth metal layer is connected to the second metal layer via a connecting bridge (27); at least one first switch (281) including a first end connected to the third metal layer and a second end connected to the second metal layer; and at least one second switch (282) including a third end connected to the fourth metal layer and a fourth end connected to the first metal layer; wherein the projection of the first metal layer and the projection of the third metal layer are overlapped to form a first overlapping area; wherein the direction of the current flowing through the first metal layer is opposite to the direction of the current flowing through the third metal layer.
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公开(公告)号：EP4075498A2
公开(公告)日：2022-10-19
申请号：EP22176308.9
申请日：2019-06-17
发明人： HONG, Shouyu , XU, Haibin , CHENG, Wei , CHENG, Juan , WANG, Tao , ZHAO, Zhenqing
IPC分类号： H01L25/07 , H02M7/00 , H05K7/14 , H01L23/498 , H01L23/538
摘要： A power module structure includes a first metal layer (41), a second metal layer (42), a third metal layer (43) and a fourth metal layer (44), wherein the fourth metal layer (44) is connected to the second metal layer (42) via a plurality of connecting bridges (27), each of the connecting bridges (27) is a pillar connecting bridge (27); a plurality of first switches (281), each first switch (281) including a first end connected to the third metal layer (43) and a second end connected to the second metal layer (42); and a plurality of second switches (282), each second switch (282) including a third end connected to the fourth metal layer (44) and a fourth end connected to the first metal layer (41).
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公开(公告)号：EP4075497A3
公开(公告)日：2023-03-01
申请号：EP22176306.3
申请日：2019-06-17
发明人： HONG, Shouyu , XU, Haibin , CHENG, Wei , CHENG, Juan , WANG, Tao , ZHAO, Zhenqing
IPC分类号： H01L25/07 , H02M7/00 , H05K7/14 , H01L23/498 , H01L23/538
摘要： A power module structure includes a first metal layer (41), a second metal layer (42), a third metal layer (43) and a fourth metal layer (44), wherein the fourth metal layer (44) is connected to the second metal layer (42) via a connecting bridge (27) having a first part (271); at least one first switch (281); and at least one second switch (282); wherein a current direction of the first metal layer (41) is opposite to a current direction of the first part (271) and a current direction of the fourth metal layer (44), a current direction of the third metal layer (43) is opposite to a current direction of the first part (271) and a current direction of the second metal layer (42).
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公开(公告)号：EP3598490A1
公开(公告)日：2020-01-22
申请号：EP19185348.0
申请日：2019-07-09
发明人： CHENG, Wei , HONG, Shouyu , LIAN, Dongfang , WANG, Tao , ZHAO, Zhenqing
摘要： A power module, including: a first conductor (10), disposed at a first reference plane; a second conductor (20), disposed at a second reference plane, wherein projections of the first and second conductors (20) on the first reference plane have a first overlap area; a third conductor (30, 3001, 3002, 3003), disposed at a third reference plane; a plurality of first switches (711, 712, 713, 714, 7111, 7112, 7113, 7114, 7121, 7122, 7123, 7124, 7131, 7132, 7133, 7134), first ends of which are coupled to the first conductor (10); and a plurality of second switches (721, 722, 7211, 7212, 7221, 7222, 7231, 7232), first ends of which are coupled to second ends of the first switches (711, 712, 713, 714, 7111, 7112, 7113, 7114, 7121, 7122, 7123, 7124, 7131, 7132, 7133, 7134) through the third conductor (30, 3001, 3002, 3003), and second ends of the second switches (721, 722, 7211, 7212, 7221, 7222, 7231, 7232) are coupled to the second conductor (20), wherein projections of minimum envelope areas of the first and second switches (721, 722, 7211, 7212, 7221, 7222, 7231, 7232) on the first reference plane have a second overlap area, and the first and second overlap areas have an overlap region. Heat sources of the power module are evenly distributed and its parasitic inductance is low.
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公开(公告)号：EP4075498A3
公开(公告)日：2023-03-01
申请号：EP22176308.9
申请日：2019-06-17
发明人： HONG, Shouyu , XU, Haibin , CHENG, Wei , CHENG, Juan , WANG, Tao , ZHAO, Zhenqing
IPC分类号： H01L25/07 , H02M7/00 , H05K7/14 , H01L23/498 , H01L23/538
摘要： A power module structure includes a first metal layer (41), a second metal layer (42), a third metal layer (43) and a fourth metal layer (44), wherein the fourth metal layer (44) is connected to the second metal layer (42) via a plurality of connecting bridges (27), each of the connecting bridges (27) is a pillar connecting bridge (27); a plurality of first switches (281), each first switch (281) including a first end connected to the third metal layer (43) and a second end connected to the second metal layer (42); and a plurality of second switches (282), each second switch (282) including a third end connected to the fourth metal layer (44) and a fourth end connected to the first metal layer (41).
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公开(公告)号：EP4075497A2
公开(公告)日：2022-10-19
申请号：EP22176306.3
申请日：2019-06-17
发明人： HONG, Shouyu , XU, Haibin , CHENG, Wei , CHENG, Juan , WANG, Tao , ZHAO, Zhenqing
IPC分类号： H01L25/07 , H02M7/00 , H05K7/14 , H01L23/498 , H01L23/538
摘要： A power module structure includes a first metal layer (41), a second metal layer (42), a third metal layer (43) and a fourth metal layer (44), wherein the fourth metal layer (44) is connected to the second metal layer (42) via a connecting bridge (27) having a first part (271); at least one first switch (281); and at least one second switch (282); wherein a current direction of the first metal layer (41) is opposite to a current direction of the first part (271) and a current direction of the fourth metal layer (44), a current direction of the third metal layer (43) is opposite to a current direction of the first part (271) and a current direction of the second metal layer (42).
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公开(公告)号：EP3537475B1
公开(公告)日：2020-07-15
申请号：EP19160791.0
申请日：2019-03-05
发明人： HONG, Shouyu , CHENG, Wei , ZHOU, Ganyu , ZOU, Xin , ZHAO, Zhenqing
IPC分类号： H01L21/48 , H01L23/373
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