公开(公告)号：EP3608101A1

公开(公告)日：2020-02-12

申请号：EP18781019.7

申请日：2018-04-02

申请人： Denka Company Limited

发明人： FUJIWARA, Junpei ,  IWASAKI, Takayuki ,  HIROKAW, Yasushi

IPC分类号： B32B27/00 ,  B29C47/06 ,  C09J181/06 ,  C09J201/00 ,  B29K81/00 ,  B29L7/00 ,  B29L9/00

摘要： [Problem] The present invention is to provide: a film which is excellent in film moldability, is also excellent in heat resistance and transparency, and has a small shrinkage factor and a small heating weight loss ratio even under a high-temperature atmosphere; and a heat-resistant adhesive tape comprising the same.
[Solution] A multilayer film having alternately laminated therein one or more layers of each of a substrate layer (A) comprising a sulfone-based resin having a glass transition temperature of 200°C or more and an adhesive layer (B) comprising a thermoplastic resin having a glass transition temperature of 190°C or more, and a multilayer film excellent in film moldability, heat resistance, and transparency is obtained due to at least one outermost layer of the multilayer film comprising the adhesive layer (B) and the arithmetic mean surface roughness Ra of a surface of at least one outermost layer of the multilayer film being greater than 0.1 µm and less than 10.0 µm.