专利检索 ap:("Denki Kagaku Kogyo Kabushiki Kaisha") AND inv:"HANAZATO Shingo" 第 1 页

1.

发明授权
COMPOSITE PARTICLES AND PROCESS FOR PRODUCING THE COMPOSITE PARTICLES 有权
标题翻译：复合粒子及其制造方法复合粒子

公开(公告)号：EP2386590B1

公开(公告)日：2014-10-29

申请号：EP09834864.2

申请日：2009-12-22

申请人： Denki Kagaku Kogyo Kabushiki Kaisha

发明人： KAWASAKI Takashi , FUKAZAWA Motoharu , HANAZATO Shingo , MIYATA Kouji , SUGIMOTO Isao

IPC分类号： C08G77/04 , C08F2/28 , C08F18/08 , C08L31/04 , C08L83/04 , C09D4/00 , C09D7/12 , C09D201/00 , B01J13/22 , C09D183/04 , C08K9/08 , B01J13/18 , C08F218/08 , C08G77/14 , C08G77/18 , C08K7/22

CPC分类号： C08F2/28 , B01J13/18 , C08F218/08 , C08G77/14 , C08G77/18 , C08K7/22 , C09D7/67 , C09D7/68 , C09D7/70 , C09D183/04 , Y10T428/249974 , Y10T428/2982 , Y10T428/2998 , C08L2666/04

摘要： An organic polymer-silicon compound composite particle comprising (a) a core composed of an organic polymer particle containing polyvinyl acetate as a principal component and (b) a shell containing a silicon compound, an average particle size of the organic polymer-silicon compound composite particle being 5 to 150 nm.

2.

发明公开
COMPOSITE PARTICLES, PROCESS FOR PRODUCING THE COMPOSITE PARTICLES, HOLLOW PARTICLES, PROCESS FOR PRODUCING THE HOLLOW PARTICLES, AND USE OF THE HOLLOW PARTICLES 有权
标题翻译： VERBUNDPARTIKEL UND VERFAHREN ZUR HERSTELLUNG DER VERBUNDPARTIKEL

公开(公告)号：EP2386590A1

公开(公告)日：2011-11-16

申请号：EP09834864.2

申请日：2009-12-22

申请人： Denki Kagaku Kogyo Kabushiki Kaisha

发明人： KAWASAKI Takashi , FUKAZAWA Motoharu , HANAZATO Shingo , MIYATA Kouji , SUGIMOTO Isao

IPC分类号： C08G77/04 , C08F2/28 , C08F18/08 , C08L31/04 , C08L83/04 , C09D4/00 , C09D7/12 , C09D201/00

CPC分类号： C08F2/28 , B01J13/18 , C08F218/08 , C08G77/14 , C08G77/18 , C08K7/22 , C09D7/67 , C09D7/68 , C09D7/70 , C09D183/04 , Y10T428/249974 , Y10T428/2982 , Y10T428/2998 , C08L2666/04

摘要： An organic polymer-silicon compound composite particle comprising (a) a core composed of an organic polymer particle containing polyvinyl acetate as a principal component and (b) a shell containing a silicon compound, an average particle size of the organic polymer-silicon compound composite particle being 5 to 150 nm.

摘要翻译： 一种有机聚合物 - 硅化合物复合颗粒，其包含（a）由含有聚乙酸乙烯酯作为主要成分的有机聚合物颗粒构成的芯和（b）含有硅化合物的壳，所述有机聚合物 - 硅化合物复合物的平均粒径颗粒为5至150nm。