公开(公告)号：EP2584579A1

公开(公告)日：2013-04-24

申请号：EP11795755.5

申请日：2011-06-15

申请人： Dexerials Corporation

发明人： YONEDA, Yoshihiro

IPC分类号： H01H37/76

CPC分类号： H01H61/02 ,  H01H37/761 ,  H01H69/02 ,  H01H85/046 ,  H01H2037/046 ,  H01H2037/768 ,  Y10T29/49107

摘要： A protective element that is capable of promptly reliably disconnecting a current path by taking advantage of the erosion phenomenon of a solder in a melted state. A plurality of electrodes (114) are formed by a first electrically conductive layer (112) deposited on a substrate (111) and by a plurality of second electrically conductive layers (113) spaced apart from one another in the in-plane direction of the substrate (111) on which the first electrically conductive layer (112) has been deposited. A solder paste (116) has a wetting performance for the electrodes (114) higher than that for the substrate (111) and is deposited on top of the first and second electrically conductive layers (112, 113) formed on the substrate. The solder paste melts by at least one out of heat generated by a resistor (103) and heat generated by a stack of the electrodes (114) and the solder paste (116) in such a manner that, as the solder paste erodes the portion of the first electrically conductive layer (112) intermediate between the electrodes (114), it is attracted towards the electrodes (114) exhibiting higher wettability by it than that of the substrate (111).

摘要翻译： 能够通过利用熔融状态的焊料的侵蚀现象，能够及时可靠地断开电流路径的保护元件。 多个电极（114）由沉积在基板（111）上的第一导电层（112）和多个第二导电层（113）形成，多个第二导电层（113）沿着 已经沉积有第一导电层（112）的衬底（111）。 焊膏（116）对于电极（114）具有比衬底（111）高的润湿性能，并且沉积在形成在衬底上的第一和第二导电层（112,113）的顶部上。 焊膏通过由电阻器（103）产生的热量中的至少一种和由电极（114）和焊膏（116）的堆叠产生的热量以这样的方式熔化，使得当焊膏侵蚀部分 在电极（114）之间的第一导电层（112）中，其被吸引到显示出比衬底（111）更高的润湿性的电极（114）。

公开(公告)号：EP2538513B1

公开(公告)日：2016-04-20

申请号：EP10846198.9

申请日：2010-12-29

申请人： Dexerials Corporation

发明人： MUKAI, Koichi ,  ISHIMARU, Masahiko ,  ASADA, Takahiro ,  KOMORI, Chisato ,  YONEDA, Yoshihiro ,  KIMURA, Yuuji ,  NAGAKI, Shoko

IPC分类号： H02H7/18 ,  H01M2/10 ,  H01M10/44 ,  H01M10/48 ,  H02H3/08 ,  H02J7/00 ,  H01M2/34

CPC分类号： H01M2/348 ,  H01M10/0525 ,  H01M10/443 ,  H01M10/48 ,  H02H7/18 ,  H02J7/0031 ,  Y02E60/12

公开(公告)号：EP2797098A1

公开(公告)日：2014-10-29

申请号：EP12858846.4

申请日：2012-12-17

申请人： Dexerials Corporation

发明人： KOMORI, Chisato ,  FURUUCHI, Yuji ,  YONEDA, Yoshihiro ,  MUKAI, Koichi ,  EJIMA, Koji ,  FUJIHATA, Takashi ,  FURUTA, Kazutaka ,  ARAKI, Toshiaki

IPC分类号： H01H37/76 ,  H01M2/34 ,  H01M10/44 ,  H01M10/48 ,  H02H3/08 ,  H02H7/18 ,  H02J7/00

CPC分类号： H01M2/34 ,  H01H37/761 ,  H01H85/046 ,  H01H2085/0275 ,  H01H2085/466 ,  H01M10/0525 ,  H01M2200/103 ,  H02H3/08 ,  H02H7/18 ,  H02H9/041 ,  H02H9/042 ,  H02J7/0031 ,  H02J2007/0037 ,  H02J2007/004

摘要： An object of the present invention is to provide a protective element with which, while implementing a reduced height, a reliable blowout of a low-melting point metal upon a current path by heat of a heating body is possible. The protective element includes: a substrate (11) in which a concave portion (11a) is formed, a heating body (12) which is layered in the concave portion (11a); a second substrate (13) which is layered upon the substrate (11) to cover the heating body (12); first and second electrodes (14a), (14b) which are layered upon the surface of the substrate (11) on which the second substrate (13) is layered; a heating body electrode (15) which is layered upon the second substrate (13) to be superimposed with the heating body (12), and which is electrically connected to the heating body (12) and a current path between the first and the second electrodes; and a low-melting point element (16) which is layered from the heating body electrode to the first and second electrodes, and which causes a blowout of the current path between the first electrode and the second electrode by heating. The heating body electrode (15) is positioned in the same location relative to the first electrode (14a) and the second electrode (14b) which is specified in the thickness direction of the substrate (11).

摘要翻译： 本发明的一个目的是提供具有一个保护元件，同时通过一个加热体的热实现一个高度降低，低融点金属的时的电流路径的可靠井喷是可能的。 所述保护元件包括：其中的凹部（11A）形成在基板（11），其在凹部（11A）层叠的加热体（12）; 第二衬底（13）层积在所述衬底（11）以覆盖所述加热体（12）; 第一和第二电极（14A），（14B），它们是在基片（11）在其上第二基片（13）是叠层的表面分层; 这是在（13），以与所述加热体（12）被叠加在第二基板层叠发热体电极（15）所有，并且所有这些都被电连接到所述加热体（12）和在第一和第二之间的电流路径 电极; 和从加热体电极层叠到所述第一电极和第二电极，以及其中低熔点元件（16）的所有使第一电极和通过加热所述第二电极之间的电流路径的一个井喷。 加热体电极（15）在相对于所述第一电极（14a）和所述第二电极相同的位置被定位（图14B），其在所述基板的厚度方向（11）指定的所有。