公开(公告)号：EP4130157A1

公开(公告)日：2023-02-08

申请号：EP21781180.1

申请日：2021-03-26

申请人： Dow Toray Co., Ltd.

发明人： YAMAZAKI, Ryosuke ,  YAMAMOTO, Shinichi ,  OZAKI, Kouichi ,  IMAIZUMI, Toru

IPC分类号： C08L83/07 ,  B32B27/00 ,  B32B27/16 ,  B32B27/18 ,  B32B27/26 ,  C08L83/05 ,  C09J183/05 ,  C09J183/07 ,  H01L23/29 ,  H01L23/31

摘要： PROBLEM
To provide a hot-melt curable silicone composition that forms a cured product that can be cured at a low temperature of 100°C or lower, has excellent storage stability, is relatively hard from curing, and has low surface tack, and a sheet or film containing same.
RESOLUTION MEANS
A curable hot-melt silicone composition of the present invention having hot-melt properties as a whole, containing: (A) a solid organopolysiloxane resin that contains at a mass ratio of 0:100 to 90:10 (A1) an organopolysiloxane resin having a curing reactive functional group and containing 20 mol% or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group and containing 20 mol% or more of a Q unit; (B) 10 to 100 parts by mass of a straight-chain or branched-chain organopolysiloxane having a curing reactive functional group and is liquid or has plasticity; (C) an organohydrogenpolysiloxane; and (D) a photoactivated hydrosilylation reaction catalyst.

公开(公告)号：EP4083140A1

公开(公告)日：2022-11-02

申请号：EP20906709.9

申请日：2020-12-28

申请人： Dow Toray Co., Ltd.

发明人： YAMAZAKI, Ryosuke ,  OZAKI, Kouichi ,  IMAIZUMI, Toru

IPC分类号： C08L83/07 ,  B32B27/00 ,  C08L83/05 ,  C09J7/35 ,  C09J11/06 ,  C09J183/05 ,  C09J183/07 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

摘要： [Problem]
To provide a curable hot-melt silicone composition that is less susceptible to curing inhibition and with excellent storage stability, and a sheet or film containing the same.
[Resolution Means]
A curable hot-melt silicone composition of the present invention contains: (A) a solid organopolysiloxane resin containing a specific ratio of (A1) an organopolysiloxane resin having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol% or more of a Q unit, and (A2) an organopolysiloxane resin not having a curing reactive functional group that contains a carbon-carbon double bond and containing 20 mol% or more of a Q unit; (B) a chain organopolysiloxane having a curing reactive functional group that contains at least two carbon-carbon double bonds; (C) an organohydrogenpolysiloxane resin having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100°C for 1 hour under atmospheric pressure; and (D) a hydrosilylation reaction catalyst, the curable hot-melt silicone composition having hot-melt properties as a whole.

公开(公告)号：EP3954739A1

公开(公告)日：2022-02-16

申请号：EP20782189.3

申请日：2020-03-18

申请人： Dow Toray Co., Ltd.

发明人： YAMAZAKI, Ryosuke ,  OZAKI, Kouichi ,  IMAIZUMI, Toru ,  HAYASHI, Masayuki

IPC分类号： C08L83/07 ,  B32B27/00 ,  B32B27/18 ,  B32B27/26 ,  C08K3/013 ,  C08K5/14 ,  C08L83/04 ,  C08L83/05 ,  C09J7/35 ,  C09J183/07 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

摘要： [Problem]
To provide a curable silicone composition with hot-melt properties, excellent workability, and curing characteristics such as overmolding, and a cured product that does not become hard or brittle even if left at a temperature of 150°C or higher for a long time.
[Solution]
A curable silicone composition that has hot-melt properties as an entire composition, containing:
an organopolysiloxane resin or resin mixture which is non-hot-meltable as a whole molecule, containing a siloxane unit represented by SiO 4/2 making up at least 20 mol% or more of the total siloxane units and has a mass loss of 2.0 mass% or less when exposed to 200°C for 1 hour; a liquid straight-chain or branched chain organopolysiloxane; and a curing agent.

公开(公告)号：EP3699236A1

公开(公告)日：2020-08-26

申请号：EP18868669.5

申请日：2018-10-15

申请人： Dow Toray Co., Ltd.

发明人： YAMAZAKI, Ryosuke ,  IMAIZUMI, Toru ,  OZAKI, Kouichi

IPC分类号： C08L83/07 ,  C08K5/14 ,  C08L83/05 ,  H01L23/29 ,  H01L23/31

摘要： [Problem to be Solved] To provide a curable granular silicone composition which has hot-melt properties, is excellent in terms of handleability and curability in overmolding and the like, and gives cured objects and the like highly inhibited from taking a color at high temperatures.
[Solution] A curable granular silicone composition characterized by comprising (A) organopolysiloxane resin fine particles which do not have hot-melt properties and have a curing-reactive functional group containing a carbon-carbon double bond and in which siloxane units represented by RSiO 3/2 (R is a monovalent organic group) or SiO 4/2 account for at least 20 mol% of all the siloxane units, (B) a liquid, linear or branched organopolysiloxane having, in the molecule, at least two curing-reactive functional groups containing a carbon-carbon double bond, (C) a hardener, and (D) a functional filler, the composition as a whole having hot-melt properties; and uses of the curable granular silicone composition.