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    Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
    1.
    发明公开
    Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof 审中-公开
    Mittels einer Nassbehandlung hergestelltes Leistungs-Modul-Element，Nassbehandlungsverfahren und Vorrichtung zur Nassbehandlung

    公开(公告)号：EP1349206A2

    公开(公告)日：2003-10-01

    申请号：EP03007016.3

    申请日：2003-03-27

    申请人： Dowa Mining Co., Ltd.

    发明人： Iyoda, Ken, Dowa Mining Co., Ltd. ,  Namioka, Makoto, Dowa Mining Co., Ltd. ,  Osanai, Hideyo, Dowa Mining Co., Ltd. ,  Shimada, Susumu, Dowa Mining Co., Ltd.

    IPC分类号： H01L21/50

    CPC分类号： H05K3/068 ,  H01L21/4846 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K3/0085 ,  H01L2924/00

    摘要： The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed. Further, the integrally bonded member 10 is pressed with an appropriate pressure from a base plate 11 side so that a boundary surface between a portion 23 surrounding the window portion in the masking member and an exposed surface 16 of the ceramic substrate which is exposed in a metal-ceramic bonded member 14 has a state not allowing a liquid to pass therethrough. Thereafter, a treatment solution 33 for wet treatment is injected from an injection pipe 35 to be in contact with the circuit pattern forming metal plate 13.

    摘要翻译： 本发明提供了在整体接合部件上形成电路图案的方法，该方法不需要在整体接合部件进行湿处理时必需的层压膜或抗蚀剂膜的校正步骤。 在电路图案形成金属板13接合在陶瓷基板12的一部分上以便将整体接合部件10中的陶瓷基板12的外周边缘部分露出之后，将整体接合部件10设置在处理装置 同时覆盖有具有窗口部分22的掩模构件20，整体接合构件10的电路图案形成金属板13从该窗口部分22露出。 此外，整体接合部件10以适当的压力从基板11侧按压，使得围绕掩模部件中的窗口部分的部分23与暴露在陶瓷基板的暴露表面16之间的边界面 金属陶瓷接合部件14具有不允许液体通过的状态。 之后，从注入管35注入湿润处理用处理液33，与电路图案形成用金属板13接触。