公开(公告)号：EP1578559A1

公开(公告)日：2005-09-28

申请号：EP03788702.3

申请日：2003-09-17

Applicant: EBARA CORPORATION

Inventor： NAGASAWA, Hiroshi ,  KAGOSHIMA, Kaori ,  OGURE, Naoaki ,  HIROSE, Masayoshi ,  CHIKAMORI, Yusuke

IPC: B23K35/02 ,  B22F7/06 ,  B22F1/00

CPC classification number: B22F1/0022 ,  B22F1/0059 ,  B22F1/0062 ,  B22F7/064 ,  B22F2998/00 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3612 ,  B23K2201/36 ,  B82Y30/00 ,  C09J5/06 ,  C09J11/04 ,  C09J2400/163 ,  H01L23/4828 ,  H01L24/81 ,  H01L2224/11332 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1572 ,  B22F1/0018 ,  H01L2924/00

Abstract: There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.

公开(公告)号：EP1578559B1

公开(公告)日：2009-03-18

申请号：EP03788702.3

申请日：2003-09-17

Applicant: EBARA CORPORATION

Inventor： NAGASAWA, Hiroshi ,  KAGOSHIMA, Kaori ,  OGURE, Naoaki ,  HIROSE, Masayoshi ,  CHIKAMORI, Yusuke

IPC: B23K35/02 ,  B22F7/06 ,  B22F1/00

CPC classification number: B22F1/0022 ,  B22F1/0059 ,  B22F1/0062 ,  B22F7/064 ,  B22F2998/00 ,  B22F2999/00 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3612 ,  B23K2201/36 ,  B82Y30/00 ,  C09J5/06 ,  C09J11/04 ,  C09J2400/163 ,  H01L23/4828 ,  H01L24/81 ,  H01L2224/11332 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29339 ,  H01L2224/2949 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8184 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/351 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1572 ,  B22F1/0018 ,  H01L2924/00

Abstract: There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.