公开(公告)号：EP1780306A2

公开(公告)日：2007-05-02

申请号：EP06022309.6

申请日：2006-10-25

申请人： EBARA CORPORATION

发明人： Owatari, Akira ,  Saijo, Yasuhiko ,  Tsujino, Junichiro

IPC分类号： C23C18/54 ,  C23C18/16

CPC分类号： C23C18/1628 ,  C23C18/1617 ,  C23C18/1619 ,  C23C18/32

摘要： An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter.

摘要翻译： 化学镀设备能够以良好的选择性稳定地在嵌入式互连的暴露表面上形成保护膜，从而保护互连。 化学镀设备包括用于磁性去除未被过滤器去除的化学镀溶液中的小磁悬浮固体的磁性去除部分。