专利检索 ap:("ESIONIC 3000 INC") AND inv:"LIU ZHIMING" 第 1 页

1.

发明公开
METHODS OF TREATING COPPER SURFACES FOR ENHANCING ADHESION TO ORGANIC SUBSTRATES FOR USE IN PRINTED CIRCUIT BOARDS 审中-公开
标题翻译： METHOD FOR铜表面，用于FOR USE用于电路板有机底物的增加的责任处理

公开(公告)号：EP2591645A4

公开(公告)日：2015-10-21

申请号：EP10854525

申请日：2010-07-06

申请人： ESIONIC 3000 INC

发明人： WEI JEN-CHIEH , LIU ZHIMING , SHI STEVEN Z , KUHR WERNER G

IPC分类号： H05K3/38 , H05K3/46

CPC分类号： H05K3/385 , H05K1/09 , H05K3/389 , H05K3/4652 , H05K2203/1157 , Y10T156/10

摘要： Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps.