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    PEELABLE COPPER FOILS, MANUFACTURING METHOD OF CORELESS SUBSTRATE, AND CORELESS SUBSTRATE OBTAINED BY THE MANUFACTURING METHOD
    5.
    发明公开
    PEELABLE COPPER FOILS, MANUFACTURING METHOD OF CORELESS SUBSTRATE, AND CORELESS SUBSTRATE OBTAINED BY THE MANUFACTURING METHOD 审中-公开
    可剥皮铜箔，无损衬底的制造方法和制造方法获得的无尘衬底

    公开(公告)号：EP3241415A1

    公开(公告)日：2017-11-08

    申请号：EP14824496.5

    申请日：2014-12-30

    Applicant: Circuit Foil Luxembourg

    Inventor： MOUZON, Julie ,  PETRY, Jérôme ,  VAST, Laurence

    IPC: H05K3/02 ,  H05K3/04 ,  H05K3/46

    CPC classification number: H05K3/4682 ,  B32B15/01 ,  B32B15/015 ,  C25D5/10 ,  C25D7/0614 ,  C25D9/08 ,  H05K3/022 ,  H05K3/025 ,  H05K3/4652

    Abstract: The present invention provides a ultrathin peelable copper foil for manufacturing coreless substrate, comprising a chemical treatment layer, an ultrathin functional copper layer provided below the chemical treatment layer, a metallic release layer provided below the ultrathin functional copper layer, a carrier copper layer provided below the metallic release layer, and a roughening and chemical treatment layers provided below the carrier copper layer. The present invention also provides a peelable copper foil comprising a chemical treatment layer, a carrier copper layer provided below the chemical treatment layer, a metallic release layer provided below the carrier copper layer, an ultrathin functional copper layer provided below the metallic release layer, a smooth roughening and chemical treatment layers provided below the ultrathin functional copper layer, and a primer layer provided below the smooth roughening and chemical treatment layers. The present invention also provides a method of manufacturing a coreless substrate, comprising: (a) forming the ultrathin peelable copper foil of the exemplary embodiment of the present invention as a first ultrathin peelable copper foil, (b) laminating the first ultrathin peelable copper foil on each side of a central prepreg to form a primary central core, (c) forming the ultrathin peelable copper foil of another exemplary embodiment of the present invention as the second peelable copper foil, (d) laminating the second peelable copper foil on a build-up film, (e) combining the primary central core obtained in (b) with a laminate obtained in (d), or laminating the laminate on one or both sides of the primary central core, (f) separating the metallic release layer on the carrier copper layer and the functional copper layer of the second peelable copper foil from the structure obtained in (e), and (g) removing the primary central core except for the ultrathin functional copper layer and the chemical treatment layer from the structure obtained in (f).

    PRINTED CIRCUIT BOARD
    8.
    发明公开
    PRINTED CIRCUIT BOARD 有权
    LEITERPLATTE

    公开(公告)号：EP2916629A4

    公开(公告)日：2016-07-13

    申请号：EP14854898

    申请日：2014-01-14

    Applicant: MEIKO ELECTRONICS CO LTD

    Inventor： ISHIKAWA AKIHIRO ,  YAMAMOTO TORU ,  INOKUCHI KAZUYA

    IPC: H05K3/28 ,  H05K1/02 ,  H05K3/46

    CPC classification number: H05K1/028 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0278 ,  H05K1/0281 ,  H05K3/0044 ,  H05K3/282 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2203/0207 ,  H05K2203/0228

    Abstract: A printed wiring board (10) includes: an inner layer structure body (20) containing at least an inner layer insulative base material (31) composed of a glass cloth (31a) and resin (31b) which covers the glass cloth (31a) and not containing a resin insulative base material composed only of resin; outer layer wiring (21) formed on a first face (20a) of the inner layer structure body (20); and a solder resist layer (23) formed on a surface of the outer layer wiring (21), wherein in the inner layer structure body (20), an opening part (11) is formed, and the solder resist layer (23) is composed of a first ink part (23a) covering at least the outer layer wiring (21) that is formed on a partial region of the first face (20a) which corresponds to the opening part (11) and a second ink part (23b) interposing both ends of the first ink part (23a) and being lower in flexibility than the first ink part (23a).

    Abstract translation: 印刷电路板（10）包括：内层结构体（20），其至少包含由玻璃布（31a）构成的内层绝缘基材（31）和覆盖玻璃布（31a）的树脂（31b） 不含仅由树脂构成的树脂绝缘基材; 形成在所述内层结构体（20）的第一面（20a）上的外层布线（21） 以及形成在所述外层布线（21）的表面上的阻焊层（23），其中，在所述内层结构体（20）中形成有开口部（11），所述阻焊层（23）为 由形成在与开口部分（11）对应的第一面（20a）的部分区域上的至少覆盖外层布线（21）的第一墨水部分（23a）和第二墨水部分（23b）组成， 插入第一墨水部分（23a）的两端并且柔性比第一墨水部分（23a）低。

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