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    ILLUMINATION DEVICE AND DEVICE FRAME THEREOF
    1.
    发明公开
    ILLUMINATION DEVICE AND DEVICE FRAME THEREOF 审中-公开

    公开(公告)号：EP3454369A1

    公开(公告)日：2019-03-13

    申请号：EP18196452.9

    申请日：2013-05-29

    申请人： Epistar Corporation

    发明人： PAN, Shyi-Ming ,  CHENG, Wei-Kang ,  HUANG, Chih-Shu ,  LEE, Chen-Hong ,  YEH, Shih-Yu ,  PU, Chi-Chih ,  YANG, Cheng-Kuang ,  TANG, Shih-Chieh ,  HONG, Siang-Fu ,  WANG, Tzu-Hsiang

    IPC分类号： H01L25/075 ,  H01L33/50 ,  F21Y107/50 ,  F21Y109/00 ,  F21Y115/10 ,  H01L33/64

    摘要： A light emitting element (1; 310) includes a transparent substrate (2) and a plurality of light emitting diode (LED) chips (3; 14). The transparent substrate (2) has a support surface (210) and a second main surface (21B) disposed opposite to each other. At least some of the LED chips (3; 14) are disposed on the support surface (210) and light emitting surfaces (34) of the LED chips (3; 14) and at least a part of the support surface (210) form a first main surface (21A) where light is emitted from. Each of the LED chips (3; 14) includes a first electrode (16; 31A) and a second electrode (18; 31B). Light emitted from at least one of the LED chips (3; 14) passes through the transparent substrate (2) and emerges from the second main surface (21B). An illumination device (10; 10'; 11; 50; 301; 302; 303; 304) includes at least one light emitting element (1; 310) and a supporting base (5; 26; 324). The light emitting element (1; 310) is disposed on the supporting base (5; 26; 324), and an angle is formed between the light emitting element (1; 310) and the supporting base (5; 26; 324).

    PIXEL PACKAGE AND MANUFACTURING METHOD THEREOF
    5.
    发明公开
    PIXEL PACKAGE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：EP4283672A1

    公开(公告)日：2023-11-29

    申请号：EP23174589.4

    申请日：2023-05-22

    申请人： Epistar Corporation ,  Yenrich Technology Corporation

    发明人： HUANG, Li-Yuan ,  WANG, Tzu-Hsiang ,  PU, Chi-Chih ,  LIN, Ya-Wen ,  LI, Pei-Yu ,  CHIU, Hsiao-Pei

    IPC分类号： H01L25/16

    摘要： A pixel package includes a base material, a circuit structure, a plurality of light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, a plurality of bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base.