公开(公告)号：EP1330145A3

公开(公告)日：2005-08-10

申请号：EP03000693.6

申请日：2003-01-17

申请人： FCI

发明人： Volstorf, James R.

IPC分类号： H05K1/14 ,  H05K1/11 ,  H05K7/14

CPC分类号： H05K1/14 ,  H05K1/114 ,  H05K2203/1572

摘要： The invention relates to an electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other. The system includes two connector printed circuit boards, each containing pairs of electrical connections (211a, 212a). The connector boards are mounted on opposite faces of a mid-plane printed circuit board, which contains pairs of overlaying via holes on each of its faces. The via holes are positioned according to one of two schemes. In the first scheme, the via holes (111a, 112a; 111b, 112b) are positioned along an axis perpendicular to an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from a point on the axis that bisects the angle of misalignment of the connector boards. In the second scheme, the via holes are positioned along an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from each of the electrical connections. The electrical connections on each of the connector boards are connected through electrical paths (201a, 202a; 201b, 202b). Each electrical path consists of a top electrically conductive surface mount pad connecting the electrical connection on the top connector board to a via hole on the top face of the mid-plane board, a mid-plane electrical trace through the mid-plane board connecting a via hole on the top surface of the mid-plane board to the via hole directly beneath it on the bottom face of the mid-plane board, and a bottom electrically conductive surface mount pad connecting the via hole on the bottom face of the mid-plane board to the electrical connection on the bottom connector board.

公开(公告)号：EP1330145A2

公开(公告)日：2003-07-23

申请号：EP03000693.6

申请日：2003-01-17

申请人： FCI

发明人： Volstorf, James R.

IPC分类号： H05K1/14 ,  H05K1/11 ,  H05K7/14

CPC分类号： H05K1/14 ,  H05K1/114 ,  H05K2203/1572

摘要： The invention relates to an electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other. The system includes two connector printed circuit boards, each containing pairs of electrical connections (211a, 212a). The connector boards are mounted on opposite faces of a mid-plane printed circuit board, which contains pairs of overlaying via holes on each of its faces. The via holes are positioned according to one of two schemes. In the first scheme, the via holes (111a, 112a; 111b, 112b) are positioned along an axis perpendicular to an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from a point on the axis that bisects the angle of misalignment of the connector boards. In the second scheme, the via holes are positioned along an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from each of the electrical connections. The electrical connections on each of the connector boards are connected through electrical paths (201a, 202a; 201b, 202b). Each electrical path consists of a top electrically conductive surface mount pad connecting the electrical connection on the top connector board to a via hole on the top face of the mid-plane board, a mid-plane electrical trace through the mid-plane board connecting a via hole on the top surface of the mid-plane board to the via hole directly beneath it on the bottom face of the mid-plane board, and a bottom electrically conductive surface mount pad connecting the via hole on the bottom face of the mid-plane board to the electrical connection on the bottom connector board.

摘要翻译： 本发明涉及一种用于在两个印刷电路板的电连接系统安装在中间平面电路板的相对侧上彼此垂直。 该系统包括两个连接器的印刷电路板，每个都包含对电连接（211A，212A）的。 所述连接器板被安装在中平面的印刷电路板，其包含对通过在其每个面上的孔的重叠的相对面上。 过孔定位gemäß两个方案之一。 在第一方案中，通孔（111A，112A; 111B，112B）沿上轴垂直于轴线定位做平分连接器板的未对准的角度，和所述通孔是从该轴上的点等距做 平分连接器板的未对准角度。 在第二种方案中，通孔沿上轴线定位做平分连接器板的未对准的角度，和通路孔是彼此电连接的等距。 在每个连接器板的电连接通过电路径（; 201B，202B 201A，202A）相连接。 顶导电表面中的每一个电路径besteht安装焊盘连接在顶部连接器板的通孔上的中板接线板的上表面的电连接，通过中板接线板的中间平面电迹线连接 通过与通孔的中板接线板的顶表面上的过孔直接在其下方的中板接线板的底面和底部导电表面安装焊盘的通孔上中期的底面连接所述 计划板在底部连接器板的电连接。