摘要:
The invention relates to a method and a device for placing electronic components ordered in a matrix structure onto a flat carrier, comprising of picking up components ordered in accordance with a matrix structure and placing the components on the flat carrier, wherein the components are picked up in a group of components comprising subgroups and the components are placed successively per subgroup onto the flat carrier. Means are hereby provided with which numbers, pitch or orientation of groups of electronic components, in particular though not exclusively semi-conductor products, can be modified. Placing the components per subgroup moreover creates the freedom to place the subgroups on different carriers.