-
1.发明公开METHOD AND DEVICE FOR CLEANING ELECTRONIC COMPONENTS PROCESSED WITH A LASER BEAM 审中-公开对于激光清洗方法和设备处理电子元件
公开(公告)号：EP1900006A1
公开(公告)日：2008-03-19
申请号：EP06747591.3
申请日：2006-06-15
申请人： FICO B.V.
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , H01L21/67057
摘要： The present invention relates to a method for processing with a laser beam and cleaning electronic components, wherein at least one new boundary surface is formed on an electronic component with the laser beam. The invention also relates to a device for processing and cleaning electronic components, comprising at least: a laser source for generating a laser beam, and at least one carrier for supporting an assembly of unseparated electronic components, wherein the carrier and the laser beam are displaceable relative to each other.
-
2.发明公开METHOD AND DEVICE FOR LASER CUTTING AT AN ACUTE ANGLE OF CARRIERS FOR ELECTRONIC COMPONENTS 审中-公开方法和设备。电子元器件承运人的绳角激光切割
公开(公告)号：EP1938675A2
公开(公告)日：2008-07-02
申请号：EP06799542.3
申请日：2006-10-09
申请人： FICO B.V.
IPC分类号： H05K3/00
CPC分类号： H05K3/0026 , B23K26/04 , B23K26/38 , H05K3/0052 , H05K2203/1476 , H05K2203/1527
摘要： The invention relates to a method for cutting a substantially- flat carrier (22) for electronic components (23) with a laser beam(20) by mutually displacing the laser beam(20) and the carrier. The invention also relates to a device for cutting a substantially flat carrier (22) for electronic components (23) with a laser beam (20), comprising: a holder (33) for holding the flat carrier(22), a laser source(31), a frame(32) connecting the holder(33) and the laser source, and control means for mutually displacing the laser beam (20) and the holder (33).
-
3.发明公开CARRIER, HOLDER, LASER CUTTING DEVICE AND METHOD FOR SEPARATING SEMICONDUCTOR PRODUCTS USING LASER LIGHT 审中-公开CARRIER，HOLDER，激光切割装置和方法对半导体产品 - 激光光分离
公开(公告)号：EP1588405A2
公开(公告)日：2005-10-26
申请号：EP04703293.3
申请日：2004-01-19
申请人： FICO B.V.
发明人： VAN EGMOND, Henri, Joseph , ZIJL, Joannes, Leonardus, Jurrian , RENSEN, Marcel, Hermanus, Johannes
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , H01L21/6838
摘要： The invention relates to a carrier and to a holder for supporting and engaging semiconductor products during separating of the products using laser light. The invention also relates to a method for supporting and engaging semiconductor products during separating of the products using laser light.
-
-
搜索结果
3 条记录 (耗时 0.008 秒)
