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1.发明公开METHOD AND APPARATUS FOR REMOVING A CARRIER PART FROM A CARRIER WITH A SINGLE OPERATION, AND A PRODUCT REMOVED FROM A CARRIER 审中-公开方法和设备加工于一步一个车辆从梯架删除并透过这个水管框架的远程设备
公开(公告)号：EP1410434A1
公开(公告)日：2004-04-21
申请号：EP02741522.3
申请日：2002-07-08
申请人： FICO B.V.
IPC分类号： H01L21/48
CPC分类号： H01L21/4842
摘要： The invention relates to a method for removing from a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, wherein the carrier is engaged on two sides by cutting elements provided with at least one cutting edge, which cutting elements are subsequently moved toward each other such that the carrier part is separated from the remaining part of the carrier, characterized in that before the separation takes place the cutting edge projecting relative to a base of the cutting element is urged into the carrier such that the carrier deforms permanently. The invention also relates to a thus manufactured product and to an apparatus for mechanically performing the method.
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2.发明公开METHOD AND DEVICE FOR CLEANING ELECTRONIC COMPONENTS PROCESSED WITH A LASER BEAM 审中-公开对于激光清洗方法和设备处理电子元件
公开(公告)号：EP1900006A1
公开(公告)日：2008-03-19
申请号：EP06747591.3
申请日：2006-06-15
申请人： FICO B.V.
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , H01L21/67057
摘要： The present invention relates to a method for processing with a laser beam and cleaning electronic components, wherein at least one new boundary surface is formed on an electronic component with the laser beam. The invention also relates to a device for processing and cleaning electronic components, comprising at least: a laser source for generating a laser beam, and at least one carrier for supporting an assembly of unseparated electronic components, wherein the carrier and the laser beam are displaceable relative to each other.
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3.发明公开METHOD FOR RELEASING SLUG AFTER PUNCHING, AND PUNCHING MACHINE THEREFOR 审中-公开方法用于去除LOCHBUTZENS后实施的过程冲压和切削装置
公开(公告)号：EP1578571A2
公开(公告)日：2005-09-28
申请号：EP03779056.5
申请日：2003-12-04
申请人： FICO B.V.
发明人： RENSEN, Marcel, Hermanus, Johannes , VAN EGMOND, Henri, Joseph , VAN DALEN, Adrianus, Wilhelmus
IPC分类号： B26D7/18
CPC分类号： B26D7/1818 , B26D7/18 , B26F2210/08 , Y10T83/04
摘要： The invention relates to a method for releasing slug (9, 15, 25) adhering to a stamp (2, 24) in a punching machine, by carrying the stamp (2, 24), after performing a punching operation on a sheet material (4), with the active stroke at least partially through a cutting opening (6) in a cutting plate (3, 13, 21) supporting the sheet material (4), and carrying the stamp (2, 24) during the return stroke back again through the cutting opening (6) in the cutting plate (3, 13, 21) which close-fittingly encloses the stamp (2, 24). The invention also relates to a punching machine (1, 12, 17, 22) for releasing slug (9, 15, 25) adhering to a stamp (2, 24) according this method.
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4.发明公开METHOD AND DEVICE FOR LASER CUTTING AT AN ACUTE ANGLE OF CARRIERS FOR ELECTRONIC COMPONENTS 审中-公开方法和设备。电子元器件承运人的绳角激光切割
公开(公告)号：EP1938675A2
公开(公告)日：2008-07-02
申请号：EP06799542.3
申请日：2006-10-09
申请人： FICO B.V.
IPC分类号： H05K3/00
CPC分类号： H05K3/0026 , B23K26/04 , B23K26/38 , H05K3/0052 , H05K2203/1476 , H05K2203/1527
摘要： The invention relates to a method for cutting a substantially- flat carrier (22) for electronic components (23) with a laser beam(20) by mutually displacing the laser beam(20) and the carrier. The invention also relates to a device for cutting a substantially flat carrier (22) for electronic components (23) with a laser beam (20), comprising: a holder (33) for holding the flat carrier(22), a laser source(31), a frame(32) connecting the holder(33) and the laser source, and control means for mutually displacing the laser beam (20) and the holder (33).
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5.发明公开CARRIER, HOLDER, LASER CUTTING DEVICE AND METHOD FOR SEPARATING SEMICONDUCTOR PRODUCTS USING LASER LIGHT 审中-公开CARRIER，HOLDER，激光切割装置和方法对半导体产品 - 激光光分离
公开(公告)号：EP1588405A2
公开(公告)日：2005-10-26
申请号：EP04703293.3
申请日：2004-01-19
申请人： FICO B.V.
发明人： VAN EGMOND, Henri, Joseph , ZIJL, Joannes, Leonardus, Jurrian , RENSEN, Marcel, Hermanus, Johannes
IPC分类号： H01L21/00
CPC分类号： H01L21/67092 , H01L21/6838
摘要： The invention relates to a carrier and to a holder for supporting and engaging semiconductor products during separating of the products using laser light. The invention also relates to a method for supporting and engaging semiconductor products during separating of the products using laser light.
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6.发明公开METHOD AND APPARATUS FOR REMOVING A CARRIER PART FROM A CARRIER, AND A PRODUCTREMOVED FROM A CARRIER 审中-公开方法和装置一个梯形车架的车辆部件切出一个框架OUT分离产物的董事
公开(公告)号：EP1358672A1
公开(公告)日：2003-11-05
申请号：EP02711527.8
申请日：2002-01-29
申请人： FICO B.V.
IPC分类号： H01L21/48
CPC分类号： H01L21/4842 , H01L21/561 , H01L21/568 , H01L23/3121 , H01L24/97 , Y10T29/515 , Y10T83/0207 , Y10T83/04 , Y10T83/9447
摘要： The invention relates to a method for removing from a carrier a carrier part with a housing arranged thereon, characterized in that prior to performing the separating operation a notched line is arranged in the carrier on at least one side of the carrier along at least a part of the length of a separating edge to be arranged. The invention also relates to a carrier part with a housing arranged thereon, which carrier part contains openings on the side of the carrier remote from the housing which are filled with encapsulating material, manufactured with the present method. The invention moreover relates to an apparatus for performing the method.
摘要翻译： 一种用于从载体中除去在其上的壳体布置有载体部件，在进行所述分离操作的切口线worin方法是在载体沿着至少一个分离的长度的一部分设置在所述载体的至少一个侧面 要布置边缘。 因此，本发明涉及具有设置在其上的壳体，所述载体部分包含从所述壳体远程载体填充有封装材料，用本发明方法制造的侧部开口的载体的一部分。 本发明涉及多到装置用于执行该方法。
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