HEADER ASSEMBLY HAVING INTEGRATED COOLING DEVICE
    1.
    发明公开
    HEADER ASSEMBLY HAVING INTEGRATED COOLING DEVICE 审中-公开
    头部组件,集成式冷却装置

    公开(公告)号:EP1483816A4

    公开(公告)日:2006-08-30

    申请号:EP03707865

    申请日:2003-02-11

    申请人: FINISAR CORP

    摘要: A header assembly 700 including a base 702 and a platform 800 extending through the base 702 and substantially perpendicular thereto. The platform 800 includes conductive pathways 806 that connect electrical components on either side of the base 702, and the conductive pathways cooperate to form a connector 900 at the first end of the platform 800. A laser 1002 is mounted on top of a thermoelectric cooler 900 that is directly joined to the second end of the platform 800.The laser 1002 and thermoelectric cooler 900 are enclosed in a hermetic chamber cooperatively defined by the base 702, the platform 800, and a cap that is joined to the base 702. A photodiode 1004 optically coupled with the laser 1002 and a thermistor thermally coupled with the laser 1002 cooperate with the thermoelectric cooler 900 and a control circuit to facilitate control of the performance of the laser 1002.