公开(公告)号：EP3410481A1

公开(公告)日：2018-12-05

申请号：EP17173991.5

申请日：2017-06-01

Applicant: HS Elektronik Systeme GmbH

Inventor： SINNING, Richard ,  LOEFFLAD, Bernd ,  GREITHER, Markus ,  BRANTL, Peter ,  MAIER, Josef ,  SEIDEL, Rainer

IPC: H01L25/11 ,  H01L25/16 ,  H01L23/62 ,  H01L23/00 ,  H01L25/07

CPC classification number: H01L23/3735 ,  H01L23/467 ,  H01L23/62 ,  H01L24/48 ,  H01L25/071 ,  H01L25/074 ,  H01L25/117 ,  H01L25/16 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/12032 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/19107 ,  H01L2924/00014

Abstract: The present invention relates to a power semiconductor chip module (10), comprising a substrate (12) having a top side (14) and a bottom side (16); at least one first power semiconductor device (40) attached to the top side (14) of the substrate (12); at least one first conductive structure (50) thermally and electrically connecting the first power semiconductor device (40) to the top side (14) of the substrate (12); at least one second power semiconductor device (60) attached to the bottom side (16) of the substrate (12); and at least one second conductive structure (70) connecting the second power semiconductor device (60) to the bottom side (16) of the substrate (12).

公开(公告)号：EP2636942B1

公开(公告)日：2018-09-05

申请号：EP11837760.5

申请日：2011-11-04

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKEUCHI, Nobuyoshi ,  MATSUDA, Tsugihiro ,  NAGAI, Hideo ,  MIKI, Masahiro ,  UEMOTO, Takaari

IPC: F21V19/00 ,  F21K9/232 ,  F21V23/00 ,  F21Y105/00 ,  F21Y103/00 ,  F21V3/04

CPC classification number: F21V23/002 ,  F21K9/232 ,  F21V3/061 ,  F21V19/003 ,  F21V23/001 ,  F21V29/85 ,  F21Y2103/10 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4903 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A light bulb shaped lamp (100) according to the present invention includes: a hollow globe (110); an LED module (130) including a base platform (140) and an LED chip (150) mounted on the base platform (140), the LED module (130) being provided in the globe (110); a lead wire (170) for supplying power to the LED module (130); and a stem (120) extending toward the interior of the globe (110), in which the base platform (140) is directly fixed to the stem (120).

公开(公告)号：EP2543066B1

公开(公告)日：2018-08-22

申请号：EP11708620.7

申请日：2011-02-28

Applicant: Qualcomm Incorporated

Inventor： SWEENEY, Fifin ,  SHAH, Milind P. ,  VELEZ, Mario Francisco ,  GASTELUM, Damion B.

IPC: H01L25/065 ,  H01L23/498 ,  H01L25/10 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L25/03 ,  H01L21/683

CPC classification number: H01L23/3677 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/25 ,  H01L24/48 ,  H01L24/82 ,  H01L25/03 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/2518 ,  H01L2224/48091 ,  H01L2224/82001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a multi-module integrated circuit package having a package substrate and package contacts, a die is embedded in the package substrate with thermal vias that couple hotspots on the embedded die to some of the package contacts.

公开(公告)号：EP2752872B1

公开(公告)日：2018-06-27

申请号：EP14163096.2

申请日：2008-07-31

Applicant: Skyworks Solutions, Inc.

Inventor： Welch, Patrick ,  Guo, Yifan

IPC: H01L23/552

CPC classification number: H01L23/552 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48644 ,  H01L2224/48844 ,  H01L2224/73265 ,  H01L2224/85205 ,  H01L2224/85411 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An integrated electromagnetic interference (EMI) shield for a semiconductor module package. The integrated EMI shield includes a plurality of wirebond spring (216) electrically connected between a ground plane (212) in the substrate (204) of the package and a conductive layer (222) printed on the top of the package mold compound. The wirebond springs have a defined shape that causes a spring effect to provide contact electrical connection between the tops of the wirebond springs and the conductive layer. The wirebond springs can be positioned anywhere in the module package, around all or some of the devices (202) included in the package, to create a complete EMI shield around those devices.

公开(公告)号：EP2563464B1

公开(公告)日：2018-06-06

申请号：EP11720231.7

申请日：2011-04-29

Applicant: Second Sight Medical Products, Inc.

Inventor： FARAJI, Boozarjomehr ,  ZHOU, David, Daomin ,  GREENBERG, Robert, J. ,  OK, Jerry ,  TALBOT, Neil, Hamilton ,  LITTLE, James, Singleton

IPC: A61N1/375 ,  H01L21/56 ,  A61N1/36 ,  A61B5/04 ,  A61N1/05 ,  H01L23/00

CPC classification number: H01L21/563 ,  A61B5/04001 ,  A61B2562/125 ,  A61N1/0543 ,  A61N1/36046 ,  A61N1/3752 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/838 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10T156/10 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512

Abstract: The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as etching or applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.

公开(公告)号：EP1737068B1

公开(公告)日：2018-03-21

申请号：EP06010755.4

申请日：2006-05-24

Applicant: Marvell World Trade Ltd.

Inventor： Janofsky, Eric B.

IPC: H01Q1/40 ,  H01Q1/44 ,  H04J1/00 ,  H04L27/00

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01Q1/2275 ,  H01Q1/40 ,  H01Q1/44 ,  H01Q21/28 ,  H01L2224/0401

Abstract: A wireless radio-frequency (RF) module comprises an antenna to receive first RF signals, and to transmit second RF signals; a communication circuit comprising a receive circuit to produce first digital data based on the first RF signals, and a transmit circuit to produce the second RF signals based on second digital data; a host interface to provide the first digital data to a host, and to receive the second digital data from the host; an external antenna interface to receive the first RF signals from, and to transmit the second RF signals to, an external antenna; and at least one switch to provide a signal path for the first and second RF signals between the communication circuit and one of the antenna and the external antenna interface in accordance with a control signal.

公开(公告)号：EP2221870B1

公开(公告)日：2018-03-14

申请号：EP10002938.8

申请日：2007-06-13

Applicant: Hitachi, Ltd.

Inventor： Oyama, Kazuhiro ,  Mori, Mutsuhiro ,  Saito, Katsuaki ,  Koike, Yoshihiko

IPC: H01L25/07 ,  H01L25/16 ,  H01L23/24 ,  H05K1/14

CPC classification number: H05K1/144 ,  H01L23/24 ,  H01L25/072 ,  H01L25/16 ,  H01L25/162 ,  H01L25/18 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/10287 ,  H05K2201/10318 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An elastic printed board (102) is provided so that stress applied by the silicon gel (101) is absorbed by the printed board (102). Further, the printed board (102) is formed to be so narrow that the stress may be escaped. On the other hand, the wires on which a high voltage is applied are patterned on respective printed boards. This serves to prevent discharge through the surface of the same printed board served as current passage. This design makes it possible to hermetically close the power module, prevent intrusion of moisture or contamination as well as displacement, transformation and crack of the cover plate (105).

公开(公告)号：EP3284103A2

公开(公告)日：2018-02-21

申请号：EP16856029.0

申请日：2016-10-11

Applicant: Invensas Corporation

Inventor： AWUJOOLA, Abiola ,  SUN, Zhuowen ,  ZOHNI, Wael ,  PRABHU, Ashok, S. ,  SUBIDO, Willmar

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/48

CPC classification number: H01L23/552 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16265 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/215 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/4942 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73227 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.

公开(公告)号：EP3246945A1

公开(公告)日：2017-11-22

申请号：EP16170452.3

申请日：2016-05-19

Applicant: ABB Schweiz AG ,  AUDI AG

Inventor： COTTET, Didier ,  TRAUB, Felix

IPC: H01L25/07 ,  H01L23/538 ,  H02M7/00

CPC classification number: H01L23/142 ,  H01L23/24 ,  H01L23/5386 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/0603 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2924/1304 ,  H01L2924/19107 ,  H01L2924/30107 ,  H02M7/003

Abstract: A power module (10) providing a half bridge (32) comprises at least one substrate (12) and an inner metallization area (16), two intermediate metallization areas (18) and two outer metallization areas (20), each of which extends in a longitudinal direction (L) of the at least one substrate (12); wherein the two intermediate metallization areas (18) are arranged besides the inner metallization area (16) with respect to a cross direction (C) of the at least one substrate (12) and each outer metallization area (20) is arranged beside one of the two intermediate metallization areas (18) with respect to the cross direction (C); wherein the power module (10) comprises two inner sets (22) of semiconductor switches (24), each inner set (22) of semiconductor switches (24) bonded to an intermediate metallization area (18) and electrically connected to the inner metallization area (16), such that the inner sets (22) of semiconductor switches (24) form a first arm (34) of the half bridge (32); wherein the power module (10) comprises two outer sets (28) of semiconductor switches (24), each outer set (28) of semiconductor switches (24) bonded to an outer metallization area (20) and electrically connected to an intermediate metallization area (18), such that the outer sets (28) of semiconductor switches (24) form a second arm (36) of the half bridge (32).

Abstract translation: 提供半桥（32）的功率模块（10）包括至少一个衬底（12）和内部金属化区域（16），两个中间金属化区域（18）和两个外部金属化区域（20），每个中间金属化区域 在所述至少一个衬底（12）的纵向方向（L）上; 其中所述两个中间金属化区域（18）相对于所述至少一个衬底（12）的横向（C）布置在所述内部金属化区域（16）之外，并且每个外部金属化区域（20）布置在所述至少一个 两个中间金属化区域（18）相对于横向（C）; 其中功率模块（10）包括两个半导体开关（24）的内部组（22），半导体开关（24）的每个内部组（22）结合到中间金属化区域（18）并且电连接到内部金属化区域 （16），使得半导体开关（24）的内部组（22）形成半桥（32）的第一臂（34）; 其特征在于，所述功率模块（10）包括两个半导体开关（24）的外部组（28），每个外部组（28）半导体开关（24）接合到外部金属化区域（20）并且电连接到中间金属化区域 （18），使得半导体开关（24）的外组（28）形成半桥（32）的第二臂（36）。

公开(公告)号：EP1737065B1

公开(公告)日：2017-11-01

申请号：EP06010553.3

申请日：2006-05-22

Applicant: Marvell World Trade Ltd.

Inventor： Janofsky, Eric B.

IPC: H01Q1/22 ,  H01Q21/28 ,  H01Q1/40 ,  H01Q1/44 ,  H01L23/66

CPC classification number: H01Q1/2283 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/19103 ,  H01L2924/19107 ,  H01Q1/22 ,  H01Q1/2275 ,  H01Q1/40 ,  H01Q1/44 ,  H01Q21/28 ,  H01L2224/0401

Abstract: A wireless radio-frequency (RF) module comprises an antenna to receive first RF signals, and to transmit second RF signals; a communication circuit comprising a receive circuit to produce first digital data based on the first RF signals, and a transmit circuit to produce the second RF signals based on second digital data; a host interface to provide the first digital data to a host, and to receive the second digital data from the host; an external antenna interface to receive the first RF signals from, and to transmit the second RF signals to, an external antenna; and at least one switch to provide a signal path for the first and second RF signals between the communication circuit and one of the antenna and the external antenna interface in accordance with a control signal.