公开(公告)号：EP0776262B1

公开(公告)日：2001-12-05

申请号：EP95931772.8

申请日：1995-09-07

申请人： FRY'S METALS, INC.

发明人： SCHNEIDER, Alvin F. ,  BLUMEL, David B. ,  BROUS, Jack

IPC分类号： B23K35/363 ,  B23K35/362 ,  H05K3/22

CPC分类号： H05K3/3489 ,  B23K35/3615 ,  B23K35/3618

摘要： A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8 % by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10 % by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.

公开(公告)号：EP0776262A1

公开(公告)日：1997-06-04

申请号：EP95931772.0

申请日：1995-09-07

申请人： FRY'S METALS, INC.

发明人： SCHNEIDER, Alvin F. ,  BLUMEL, David B. ,  BROUS, Jack

IPC分类号： B23K35 ,  H05K3

CPC分类号： H05K3/3489 ,  B23K35/3615 ,  B23K35/3618

摘要： A rosin-free, low VOC, no-clean soldering flux consists essentially of one or more halide-free carboxylic acid activators in an aggregate amount not exceeding about 8 % by weight of the flux; one or more alkyl amines capable of forming amine salt of the one or more activators and in an aggregate amount not exceeding about 10 % by weight of the flux; and water, with or without a surfactant. The flux is particularly useful in a method of producing soldered printed wiring assemblies with minimal residual ionic contamination, so that post-soldering cleaning of the assemblies is unnecessary.