利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

2 条记录 (耗时 0.01 秒)

    Driver IC packaging module and flat display device using the same
    2.
    发明公开
    Driver IC packaging module and flat display device using the same 审中-公开
    Treiber-IC-Modulgehäuseund Flachbildschirm damit

    公开(公告)号：EP1065720A2

    公开(公告)日：2001-01-03

    申请号：EP00303447.7

    申请日：2000-04-25

    申请人： FUJITSU LIMITED

    发明人： Kawada, Toyoshi, Fujitsu Hitachi Plasma Disp. Ltd ,  Matsumoto, Norio, Fujitsu Hitachi Plasma Disp. Ltd ,  Aoki, Masami, Fujitsu Takamisawa Component Ltd ,  Iwai, Morimitsu, c/o Kyushu FHP Limited

    IPC分类号： H01L23/538 ,  G09G3/00

    CPC分类号： G09G3/10 ,  G02F1/13452 ,  H01J2217/492 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0206 ,  H05K1/147 ,  H05K1/182 ,  H05K7/20963 ,  H01L2924/00014

    摘要： A driver IC packaging module is provided which comprises a driver IC chip 10 for driving a display electrode 5a of the flat display panel 5, a substrate 11 on which the driver IC chip 10 is mounted, and a flexible substrate 12 having output wirings. On one end of the flexible substrate connection terminals are provided and on the other end output terminals are provided, so as to connect electrically at least the display electrode 5a and output pads of the driver IC chip 10. The packaging module has a structure in which the output pads of the driver IC chip 10 and the connection terminals of the flexible substrate 12 are connected directly, and the direction of exposed surfaces of the output terminals of the flexible substrate 12 connected to the display electrode 5a and the direction of the driver IC chip 10 mounting surface on the substrate 11 are directed oppositely.
    When such a driver IC packaging module is applied to a flat display device, a high heat radiation efficiency can be achieved.

    摘要翻译： 提供一种驱动器IC封装模块，其包括用于驱动平板显示面板5的显示电极5a的驱动器IC芯片10，安装驱动IC芯片10的基板11和具有输出布线的柔性基板12。 在柔性基板的一端设置连接端子，另一端设置有输出端子，以至少连接驱动IC芯片10的显示电极5a和输出焊盘。封装模块具有以下结构： 驱动IC芯片10的输出焊盘和柔性基板12的连接端子直接连接，柔性基板12的与显示电极5a连接的输出端子和驱动器IC的方向的露出面方向 衬底11上的芯片10安装表面相对地指向。 当将这种驱动器IC封装模块应用于平面显示装置时，可以实现高散热效率。