摘要:
The present invention provides a mold structure including: a concavo-convex pattern formed on its surface, wherein the mold structure is used for transferring the concavo-convex pattern onto an imprint resist layer formed on a surface of a substrate having a thickness of 0.3mm to 2.0mm by placing the concavo-convex pattern against the imprint resist layer, and wherein a thickness Dm (mm) of the mold structure, a thickness Ds (mm) of the substrate and a curl amount C (mm) of the mold structure satisfy the relationship 0.01≤10,000×(Dm 3 /Ds 3 ) 1/2 ×C 2 ≤250.
摘要:
The present invention provides a mold structure including: a concavo-convex pattern formed on its surface, wherein the mold structure is used for transferring the concavo-convex pattern onto an imprint resist layer formed on a surface of a substrate having a thickness of 0.3mm to 2.0mm by placing the concavo-convex pattern against the imprint resist layer, and wherein a thickness Dm (mm) of the mold structure, a thickness Ds (mm) of the substrate and a curl amount C (mm) of the mold structure satisfy the relationship 0.01≤10,000×(Dm 3 /Ds 3 ) 1/2 ×C 2 ≤250.