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公开(公告)号:EP0952505B1
公开(公告)日:2005-11-23
申请号:EP98937819.5
申请日:1998-08-13
发明人: OHMI, Tadahiro , KAGAZUME, Tetu, Tokyo Electron Yamanashi Ltd , SUGIYAMA, Kazuhiko, Tokyo Electron Yamanashi Ltd , DOHI, Ryousuke, Kabushiki-Kaisha Fujikin , UNO, Tomio, Kabushiki-Kaisha Fujikin , NISHINO, Kouji, Kabushiki-Kaisha Fujikin , FUKUDA, Hiroyuki, Kabushiki-Kaisha Fujikin , IKEDA, Nobukazu, Kabushiki-Kaisha Fujikin , YAMAJI, Michio, Kabushiki-Kaisha Fujikin
CPC分类号: G05D7/0647 , Y10T137/7759 , Y10T137/7761
摘要: A pressure type flow rate control apparatus to be used in a gas supply system for semiconductor manufacturing equipment, which calculates a flow rate (Q = KP1) by using a detected pressure P1 of a pressure detector (4) installed between an orifice (5) and a control valve provided upstream of the orifice (5) and outputs the difference between the calculated flow rate and a flow rate control signal as a control signal to the control valve. The orifice (5) is formed as a direct touch type metal diaphragm, and an annular gap between a valve seat and a diaphragm is made variable to allow the flow rate control range to be changed easily.
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公开(公告)号:EP0952505A1
公开(公告)日:1999-10-27
申请号:EP98937819.5
申请日:1998-08-13
发明人: OHMI, Tadahiro , KAGAZUME, Tetu, Tokyo Electron Yamanashi Ltd , SUGIYAMA, Kazuhiko, Tokyo Electron Yamanashi Ltd , DOHI, Ryousuke, Kabushiki-Kaisha Fujikin , UNO, Tomio, Kabushiki-Kaisha Fujikin , NISHINO, Kouji, Kabushiki-Kaisha Fujikin , FUKUDA, Hiroyuki, Kabushiki-Kaisha Fujikin , IKEDA, Nobukazu, Kabushiki-Kaisha Fujikin , YAMAJI, Michio, Kabushiki-Kaisha Fujikin
IPC分类号: G05D7/06
CPC分类号: G05D7/0647 , Y10T137/7759 , Y10T137/7761
摘要: A pressure-type flow rate control apparatus for use especially in the gas supply system in semiconductor manufacturing facilities. The flow control apparatus is provided with a bore-variable orifice, which permits easy switching of the fluid flow rate control range as well as size reduction of the pressure-type flow control apparatus, and offers other advantages including improved gas replaceability, prevention of dust formation, and reduced manufacturing costs of the flow control system.
The pressure-type flow rate control apparatus comprises an orifice, a control valve provided on the upstream side of the orifice, a pressure detector provided between the control valve and the orifice, and a control unit to calculate a fluid flow rate Q on the basis of a pressure P1 detected by the pressure detector with the equation Q = KP1 (K = constant) and to output in a drive for the control valve the difference between the set flow rate signal Qs and the calculated flow rate signal Q as control signal Qy, wherein the pressure P1 on the upstream side of the orifice is regulated by actuating the control valve for controlling the flow rate of the fluid downstream of the orifice with the ratio P2/P1 between the pressure P1 on the upstream side of the orifice and the downstream pressure P2 maintained at not higher than the ratio of the critical pressure of the controlled fluid, characterized in that a direct touch type metal diaphragm valve unit functions as the orifice and that the ring-shaped gap between the valve seat and the diaphragm serves as variable orifice wherein the gap is adjusted by the orifice drive.摘要翻译: 一种特别用于半导体制造设备中的气体供给系统的压力式流量控制装置。 流量控制装置设置有可变孔口,其允许容易地切换流体流量控制范围以及压力型流量控制装置的尺寸减小,并且提供其它优点,包括改进的气体替换性,防止灰尘 形成和降低流量控制系统的制造成本。 压力式流量控制装置包括孔口,设置在孔口上游侧的控制阀,设置在控制阀和孔口之间的压力检测器,以及控制单元,用于计算流体流量Q 由压力检测器检测到的压力P1以等式Q = KP1(K =常数)检测,并且在控制阀的驱动中输出设定流量信号Qs和计算流量信号Q之间的差作为控制信号Qy 其中通过致动用于控制孔口下游流体的流速的控制阀来调节孔口上游侧的压力P1,孔口上游侧的压力P1与孔口上游侧的压力P1之间的比率P2 / 下游压力P2保持在不高于受控流体的临界压力的比率,其特征在于,直接触摸型金属隔膜阀单元用作孔口,并且r 阀座和隔膜之间的成形间隙用作可变孔口,其中间隙由孔口驱动器调节。
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