公开(公告)号：EP2247780A2

公开(公告)日：2010-11-10

申请号：EP09713359.9

申请日：2009-02-20

申请人： Future-Shape GmbH

发明人： LAUTERBACH, Christl ,  STEINHAGE, Axel ,  BARTEL, André

IPC分类号： D06N7/00 ,  E04F15/18

CPC分类号： E04F15/12 ,  D06N7/0089 ,  E04F15/185 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/109 ,  Y10T428/239 ,  Y10T428/24612 ,  Y10T428/249921 ,  Y10T428/249953 ,  Y10T428/2848 ,  Y10T442/10

摘要： In a method for producing a floor covering substrate, at least one electronic construction element is embedded in a layer comprising at least one curable material. In a method for producing a substrate layer for a floor covering substrate, a substrate layer is provided wherein the substrate layer comprises a permeable structure or a mesh structure. Further, at least one electronic construction element is disposed in the substrate layer and/or applied to the substrate layer.

公开(公告)号：EP2247780B1

公开(公告)日：2015-09-16

申请号：EP09713359.9

申请日：2009-02-20

申请人： Future-Shape GmbH

发明人： LAUTERBACH, Christl ,  STEINHAGE, Axel ,  BARTEL, André

IPC分类号： D06N7/00 ,  E04F15/12 ,  E04F15/16

CPC分类号： E04F15/12 ,  D06N7/0089 ,  E04F15/185 ,  Y10T156/10 ,  Y10T156/1064 ,  Y10T156/109 ,  Y10T428/239 ,  Y10T428/24612 ,  Y10T428/249921 ,  Y10T428/249953 ,  Y10T428/2848 ,  Y10T442/10