公开(公告)号：EP0851500A2

公开(公告)日：1998-07-01

申请号：EP97308469.2

申请日：1997-10-23

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Possin, George Edward ,  Albagli, Douglas ,  Kwasnick, Robert Forrest ,  Saunders, Rowland Frederick ,  Vafi, Habib

IPC: H01L27/146

CPC classification number: H01L27/14603

Abstract: An imager array (10) includes a substrate (a) with a plurality of superimposed layers of electrically conductive and active components. Sets of scan and data lines (16,22) are electrically insulated from one another and also from a common electrode (34) and active array components (38) by dielectric material. Protection of the active components (38) against static charge potential includes resistive means between the common electrode and a ground ring conductor (14) around the array elements and in particular a thin film transistor circuit with a parallel pair of opposite polarity diode connected field effect transistors (248,250) to safely drain the static charge during subsequent fabrication, test and standby period of the imager (8), while remaining in circuit during imager operation.
Further electrostatic charge protection is provided to the array (10) by a protective apparatus adapted to support the radiation imager (8) while electrically contacting its ground ring (14) to facilitate handling and processing while protecting against electrostatic charge damage during fabrication and testing, and enabling the positioning and bonding of the flexible external connections to the contact pads of the imager. Provision is made to enable heat and pressure for thermode bonding through the fixture to the contact pads while the imager is secured within the fixture.

Abstract translation: 在操作和非操作期间防止静电荷积聚的X-Y寻址固态辐射成像器具有包括布置在相应行和列中的地址线的光电传感器阵列。 许多辐射敏感元件被布置成矩阵布置并且耦合到相应的地址线，并且公共电极结构设置在地址线上并且辐射敏感元件与地址线电绝缘并耦合到辐射敏感 元素。 接地环设置在辐射敏感元件的矩阵布置的周边周围。 耦合电路电耦合在接地导体和公共电极之间，以便提供电连接以选择性地平衡公共电极和接地环之间的电压电位。 耦合电路包括电阻大于约104欧姆的电阻元件。 耦合电路包括至少两个场效应晶体管或者一对相反极性连接的场效应晶体管并联在接地环和公共电极之间。

公开(公告)号：EP0924774A2

公开(公告)日：1999-06-23

申请号：EP98310178.3

申请日：1998-12-11

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Vafi, Habib ,  Petrick, Scott William ,  Allen, Philip Marshall ,  Saunders, Rowland Frederick

IPC: H01L31/02 ,  H01L27/146

CPC classification number: H01L31/02002 ,  H05K1/117 ,  H05K3/225 ,  H05K3/361 ,  H05K2201/0979

Abstract: A connection method for connecting scan and data or row and column drive components applies redundant multitier contacts on the components. Multitier redundant sets of contacts (12) are deposited on a fine pitch component (10), such as an X-ray detector intended to be connected to associated electronics (14). A flexible circuit (18) is then bonded to a first one of the multitier sets of contacts (12) on the fine pitch component (10), the flexible circuit (18) forming a permanent connection to the associated electronics (14). Multitier redundant sets of contacts (16) can also be deposited on the associated electronics (14). Then defect free portions of solid state X-ray detector connections can be salvaged in instances where the bonding process produces a poor connection in an isolated area, or the detector and/or associated electronics can be salvaged if either the detector or part of the associated electronics are defective.

Abstract translation: 用于连接扫描和数据或行和列驱动器组件的连接方法在组件上应用冗余多层触点。 多个冗余的触点组（12）沉积在精细间距部件（10）上，诸如旨在连接到相关电子器件（14）的X射线检测器。 然后，柔性电路（18）被接合到细间距部件（10）上的多组触点（12）中的第一个，柔性电路（18）形成与相关电子器件（14）的永久连接。 多个冗余的触点组（16）也可以沉积在相关电子装置（14）上。 然后，在接合过程在隔离区域中产生不良连接的情况下，可以对固态X射线检测器连接的无缺陷部分进行回收，或者如果检测器或相关联的一部分 电子设备有缺陷。

公开(公告)号：EP1588665A3

公开(公告)日：2006-03-08

申请号：EP05252448.5

申请日：2005-04-19

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Vafi, Habib ,  Saeed, Faisal

IPC: A61B6/03 ,  H01L21/68

CPC classification number: A61B6/032 ,  H01L2224/81 ,  H01L2924/381

Abstract: An electronic assembly having a first layer (110) and a second layer (120) is disclosed. The first layer (110) has a first interface surface (112) and a plurality of cavities (114) formed in the first interface surface (112). The second layer (120) has a second interface surface (122) and a plurality of projections (124) disposed at the second interface surface (122), where the plurality of projections (124) are aligned with and disposed at the plurality of cavities (114). An electrically conductive connecting material (130) is disposed at the plurality of cavities (114) such that the connecting material connects the plurality of projections (124) to the respective plurality of cavities (114).

公开(公告)号：EP0851500B1

公开(公告)日：2011-10-12

申请号：EP97308469.2

申请日：1997-10-23

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Possin, George Edward ,  Albagli, Douglas ,  Kwasnick, Robert Forrest ,  Saunders, Rowland Frederick ,  Vafi, Habib

IPC: H01L27/146 ,  H01L27/02

CPC classification number: H01L27/14603

公开(公告)号：EP0924774A3

公开(公告)日：1999-11-10

申请号：EP98310178.3

申请日：1998-12-11

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Vafi, Habib ,  Petrick, Scott William ,  Allen, Philip Marshall ,  Saunders, Rowland Frederick

IPC: H01L31/02 ,  H01L27/146

CPC classification number: H01L31/02002 ,  H05K1/117 ,  H05K3/225 ,  H05K3/361 ,  H05K2201/0979

Abstract: A connection method for connecting scan and data or row and column drive components applies redundant multitier contacts on the components. Multitier redundant sets of contacts (12) are deposited on a fine pitch component (10), such as an X-ray detector intended to be connected to associated electronics (14). A flexible circuit (18) is then bonded to a first one of the multitier sets of contacts (12) on the fine pitch component (10), the flexible circuit (18) forming a permanent connection to the associated electronics (14). Multitier redundant sets of contacts (16) can also be deposited on the associated electronics (14). Then defect free portions of solid state X-ray detector connections can be salvaged in instances where the bonding process produces a poor connection in an isolated area, or the detector and/or associated electronics can be salvaged if either the detector or part of the associated electronics are defective.

Abstract translation: 用于连接扫描和数据或行和列驱动器组件的连接方法在组件上应用冗余多层触点。 在精细间距部件（10）（例如旨在连接到相关电子设备（14）的X射线检测器）上沉积多层冗余触点组（12）。 然后将挠性电路（18）接合到细间距部件（10）上的多层触点组（12）中的第一组触点（12），挠性电路（18）与相关联的电子部件（14）形成永久连接。 也可以在相关的电子器件（14）上沉积多重冗余的触点组（16）。 然后，在结合过程在隔离区域中产生不良连接的情况下，可以挽救固态X射线检测器连接的无缺陷部分，或者如果检测器或相关联的部分中的任一个可以回收检测器和/ 电子产品有缺陷。

公开(公告)号：EP0924774B1

公开(公告)日：2007-08-29

申请号：EP98310178.3

申请日：1998-12-11

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Vafi, Habib ,  Petrick, Scott William ,  Allen, Philip Marshall ,  Saunders, Rowland Frederick

IPC: H01L31/02 ,  H01L27/146

CPC classification number: H01L31/02002 ,  H05K1/117 ,  H05K3/225 ,  H05K3/361 ,  H05K2201/0979

公开(公告)号：EP1588665A2

公开(公告)日：2005-10-26

申请号：EP05252448.5

申请日：2005-04-19

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Vafi, Habib ,  Saeed, Faisal

IPC: A61B6/03

CPC classification number: A61B6/032 ,  H01L2224/81 ,  H01L2924/381

Abstract: An electronic assembly having a first layer (110) and a second layer (120) is disclosed. The first layer (110) has a first interface surface (112) and a plurality of cavities (114) formed in the first interface surface (112). The second layer (120) has a second interface surface (122) and a plurality of projections (124) disposed at the second interface surface (122), where the plurality of projections (124) are aligned with and disposed at the plurality of cavities (114). An electrically conductive connecting material (130) is disposed at the plurality of cavities (114) such that the connecting material connects the plurality of projections (124) to the respective plurality of cavities (114).

Abstract translation: 公开了一种具有第一层（110）和第二层（120）的电子组件。 第一层（110）具有形成在第一界面表面（112）中的第一界面（112）和多个空腔（114）。 第二层（120）具有第二界面（122）和设置在第二界面（122）处的多个突起（124），其中多个突起（124）与多个空腔 （114）。 导电连接材料（130）设置在多个空腔（114）处，使得连接材料将多个突起（124）连接到相应的多个空腔（114）。

公开(公告)号：EP0851500A3

公开(公告)日：1999-04-14

申请号：EP97308469.2

申请日：1997-10-23

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Possin, George Edward ,  Albagli, Douglas ,  Kwasnick, Robert Forrest ,  Saunders, Rowland Frederick ,  Vafi, Habib

IPC: H01L27/146

CPC classification number: H01L27/14603

Abstract: An imager array (10) includes a substrate (a) with a plurality of superimposed layers of electrically conductive and active components. Sets of scan and data lines (16,22) are electrically insulated from one another and also from a common electrode (34) and active array components (38) by dielectric material. Protection of the active components (38) against static charge potential includes resistive means between the common electrode and a ground ring conductor (14) around the array elements and in particular a thin film transistor circuit with a parallel pair of opposite polarity diode connected field effect transistors (248,250) to safely drain the static charge during subsequent fabrication, test and standby period of the imager (8), while remaining in circuit during imager operation. Further electrostatic charge protection is provided to the array (10) by a protective apparatus adapted to support the radiation imager (8) while electrically contacting its ground ring (14) to facilitate handling and processing while protecting against electrostatic charge damage during fabrication and testing, and enabling the positioning and bonding of the flexible external connections to the contact pads of the imager. Provision is made to enable heat and pressure for thermode bonding through the fixture to the contact pads while the imager is secured within the fixture.