公开(公告)号：EP1700350A2

公开(公告)日：2006-09-13

申请号：EP04813682.4

申请日：2004-12-09

申请人： Gelcore LLC

发明人： WEAVER, Stanton, Earl, Jr. ,  CHEN, Chen-Lun Hsing ,  KOLODIN, Boris ,  STECHER, Thomas, Elliot ,  REGINELLI, James ,  HAITKO, Deborah, Ann ,  GAO, Xiang ,  ELIASHEVICH, Ivan

IPC分类号： H01L33/00

CPC分类号： H01L33/64 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.

公开(公告)号：EP1781984A2

公开(公告)日：2007-05-09

申请号：EP05771031.1

申请日：2005-07-13

申请人： Gelcore LLC

发明人： WEAVER, Stanton, Earl, Jr. ,  STECHER, Thomas, Elliot

IPC分类号： F21V1/00

CPC分类号： H05K1/181 ,  F21K9/00 ,  H01L25/0753 ,  H01L2924/0002 ,  H01S5/005 ,  H01S5/02216 ,  H01S5/02292 ,  H01S5/4025 ,  H05K1/0274 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/2054 ,  Y02P70/611 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ü) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60 % at least between about 400 nanometers and about 470 nanometers.