公开(公告)号：EP3341654A1

公开(公告)日：2018-07-04

申请号：EP16838113.5

申请日：2016-08-26

Applicant: Thin Thermal Exchange Pte Ltd ,  Contarino, Aldo

Inventor： CONTARINO, Aldo ,  FREIBERG, Michael

IPC: F21V29/00 ,  F21V29/70 ,  F21V29/74 ,  F21V7/00 ,  F21V13/00

CPC classification number: F21V29/70 ,  F21V29/74 ,  F21V29/85 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/05 ,  H05K1/181 ,  H05K3/06 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/037 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2201/10522 ,  H05K2203/0323 ,  H05K2203/082

Abstract: An evacuated core circuit board (10) for dissipating heat from a heat generating electronic component, the evacuated core circuit board comprising: at least one circuit layer (12) to which the heat generating electronic component (14) is electronically coupled; a base layer (16) a comprising a body structure (19) having a substantially hollow interior (20); and a dielectric layer (18) provided between at least a portion of the circuit layer (12) and the base layer (16), wherein the hollow interior (20) is at least partially evacuated.

公开(公告)号：EP3321326A1

公开(公告)日：2018-05-16

申请号：EP16821365.0

申请日：2016-07-04

Applicant: Mitsubishi Gas Chemical Company, Inc.

Inventor： TOMIZAWA, Katsuya ,  TAKANO, Yoichi ,  ITO, Meguru ,  SHIGA, Eisuke

IPC: C08L101/00 ,  B32B5/00 ,  B32B27/00 ,  B32B27/34 ,  C08J5/24 ,  C08J7/04 ,  C08K3/00 ,  C08K5/54 ,  C08K5/5415 ,  C08K9/06 ,  C08L79/00 ,  H05K1/03

CPC classification number: H01B3/442 ,  B32B5/00 ,  B32B27/00 ,  B32B27/34 ,  C08J5/24 ,  C08J7/04 ,  C08K3/00 ,  C08K5/20 ,  C08K5/3415 ,  C08K5/54 ,  C08K5/5415 ,  C08K5/5419 ,  C08K9/06 ,  C08L25/18 ,  C08L79/00 ,  C08L101/00 ,  C08L2203/20 ,  H01B3/50 ,  H05K1/03 ,  H05K1/0373 ,  H05K2201/0209

Abstract: It is intended to provide a resin composition that serves as a raw material for a printed circuit board excellent in chemical resistance, desmear resistance, and insulation reliability. The resin composition of the present invention contains a maleimide compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

Abstract translation: 旨在提供用作耐化学性，抗去污性和绝缘可靠性优异的印刷电路板的原材料的树脂组合物。 本发明的树脂组合物含有马来酰亚胺化合物，具有苯乙烯骨架和水解性基团或羟基的硅烷化合物和无机填料。

公开(公告)号：EP3122811B1

公开(公告)日：2018-05-16

申请号：EP15717566.2

申请日：2015-03-26

Applicant: Saint-Gobain Centre De Recherches Et D'etudes Europeen

Inventor： RAFFY, Stéphane

IPC: C08K3/22 ,  H05K1/16 ,  H05K9/00

CPC classification number: C08K3/22 ,  C08K2003/2237 ,  C08K2201/001 ,  H05K1/162 ,  H05K9/0083 ,  H05K2201/0187 ,  H05K2201/0209

公开(公告)号：EP3170868A4

公开(公告)日：2018-04-04

申请号：EP15821543

申请日：2015-07-14

Applicant: MITSUBISHI GAS CHEMICAL CO

Inventor： NOMIZU KENTARO ,  OHTA MITSURU ,  SOGAME MASANOBU ,  MABUCHI YOSHINORI

IPC: H05K1/03 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  C08K3/34 ,  C08K5/3415 ,  C08K9/02 ,  C08L101/00

CPC classification number: C08L79/04 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  C08J2379/04 ,  C08J2463/04 ,  C08J2479/08 ,  C08K3/34 ,  C08K5/3415 ,  C08K9/02 ,  C08L101/00 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/06

Abstract: A resin composition comprising: an inorganic filler (B) comprising an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 µm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

公开(公告)号：EP2506320A4

公开(公告)日：2017-12-06

申请号：EP10832865

申请日：2010-11-26

Applicant: NITTO DENKO CORP

Inventor： KITAGAWA DAISUKE ,  TAKAYAMA YOSHINARI ,  SUEHIRO ICHIRO ,  USUI HIDEYUKI ,  ODA TAKASHI

IPC: H05K1/03 ,  H01L23/373 ,  H01L33/60 ,  H01L33/64

CPC classification number: H05K1/0373 ,  C08L27/18 ,  H01L23/3735 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The LED mounting substrate of the present invention includes a thermally conductive layer (thermally conductive sheet (10)) made of a composition containing boron nitride powder and a fluororesins, and the fluororesin contains polytetrafluoroethylene. The thermally conductive layer has a thermal conductivity of 2 W/(m€¢K) or more. The thermally conductive layer has a reflectance of 0.80 or more at wavelengths of 380 nm, 470 nm, and 650 nm.

公开(公告)号：EP3115416A4

公开(公告)日：2017-11-08

申请号：EP14884871

申请日：2014-05-21

Applicant: SHENGYI TECHNOLOGY CO LTD

Inventor： CHEN YONG

IPC: C08L63/00 ,  C08G59/42 ,  C08K5/10 ,  C08L25/06

CPC classification number: C08J5/24 ,  C08G59/42 ,  C08G59/4261 ,  C08J2363/00 ,  C08J2363/04 ,  C08J2363/10 ,  C08L63/00 ,  C08L2201/02 ,  C08L2203/20 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  C08L25/04 ,  C08L25/18

公开(公告)号：EP2502956B1

公开(公告)日：2017-09-20

申请号：EP10831294.3

申请日：2010-10-29

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MATSUDA, Takashi ,  KOMORI, Kiyotaka ,  NOZUE, Akiyoshi ,  SUZUE, Takayuki ,  NISHINO, Mitsuyoshi ,  ASAHI, Toshiyuki ,  KITAGAWA, Yoshito ,  TANI, Naoyuki

IPC: C08J5/24 ,  B32B5/28 ,  B32B15/08 ,  C08K3/00 ,  C08L63/00 ,  C08L101/00 ,  H01L33/64 ,  H05K1/03 ,  B32B15/14 ,  C08G59/38 ,  C08G59/40 ,  C08G59/62

CPC classification number: H05K1/0373 ,  B32B5/28 ,  B32B15/14 ,  C08G59/38 ,  C08G59/4021 ,  C08G59/621 ,  C08J5/24 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/257 ,  Y10T442/20 ,  Y10T442/3455

公开(公告)号：EP2312204B2

公开(公告)日：2017-08-23

申请号：EP10187816.3

申请日：2010-10-15

Applicant: Automotive Lighting Italia S.p.A.

Inventor： Pairetti, Alberto ,  Benfatto, Fabio

IPC: F21S8/10 ,  F21V29/00

CPC classification number: F21V29/85 ,  F21S43/14 ,  F21S43/195 ,  F21S45/47 ,  F21S45/48 ,  F21S48/328 ,  F21V15/01 ,  F21V29/507 ,  F21V29/763 ,  H05K1/0203 ,  H05K1/0284 ,  H05K1/0373 ,  H05K3/1216 ,  H05K2201/0209 ,  H05K2201/0999 ,  H05K2201/10106

Abstract: A lighting device for vehicles, in particular motor vehicles, comprising a body (2) made of plastic material and defining a front opening (3) closed by a transparent element (5) and housing a light source (7) formed by a plurality of LED diodes (9) arranged on a printed circuit (12) which forms the electro-thermal connection of the LEDs (9). The printed circuit (12) is arranged in thermal contact with the plastic body or a portion (13) of the body, which forms a radiating element dissipating the heat generated by the LED sources (9) to the outside.

Abstract translation: 1。一种用于车辆，尤其是机动车辆的照明装置，包括由塑料材料制成并且限定由透明元件（5）封闭的前开口（3）的主体（2），并且容纳由多个 布置在形成LED（9）的电热连接的印刷电路（12）上的LED二极管（9）。 印刷电路（12）布置成与塑料体或本体的一部分（13）热接触，所述塑料体或本体的一部分（13）形成将由LED源（9）产生的热量耗散到外部的辐射元件。

公开(公告)号：EP2859043B1

公开(公告)日：2017-08-16

申请号：EP13731510.7

申请日：2013-06-05

Applicant: Mitsubishi Engineering-Plastics Corporation

Inventor： MOTEGI, Atsushi ,  MARUYAMA, Hiroyoshi

IPC: C08L69/00

CPC classification number: C08L69/00 ,  C08K3/22 ,  C08K3/40 ,  C08L51/04 ,  C08L55/02 ,  C08L83/04 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/185 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/1136

Abstract: Provided is a resin composition excellent in mechanical strength while maintaining LDS activity. The resin composition for laser direct structuring comprises, relative to 100 parts by weight of a polycarbonate resin component, 10 to 100 parts by weight of a glass filler and 1 to 30 parts by weight of a laser direct structuring additive, wherein the polycarbonate resin component consists of 100 to 30% by weight of a polycarbonate resin and 0 to 70% by weight of a styrene-based resin; and the laser direct structuring additive comprises copper.

Abstract translation: 本发明提供维持LDS活性并且机械强度优异的树脂组合物。 用于激光直接成型的树脂组合物相对于100重量份的聚碳酸酯树脂组分包含10至100重量份的玻璃填料和1至30重量份的激光直接成型添加剂，其中聚碳酸酯树脂组分 由100至30重量％的聚碳酸酯树脂和0至70重量％的苯乙烯基树脂组成; 并且激光直接成型添加剂包含铜。

公开(公告)号：EP2397524A4

公开(公告)日：2017-08-02

申请号：EP10741312

申请日：2010-02-15

Applicant: MURATA MANUFACTURING CO

Inventor： ONOUE TOMOAKI ,  HIRAYAMA MASAAKI ,  ABURATANI YOSHIKI

IPC: C08L101/12 ,  C08K3/04 ,  C08K7/18 ,  C08K9/02 ,  C09J5/00 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01R4/04 ,  H05K3/32

CPC classification number: H05K3/321 ,  H01R4/00 ,  H01R4/04 ,  H01R4/58 ,  H05K2201/0209 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0323 ,  Y10T428/25

Abstract: To provide a conductive resin composition with which high conduction reliability can be ensured, a method for manufacturing, using the composition, an electronic component having high bonding reliability, a bonding method and a bonding structure by which objects to be bonded can be bonded to each other with certainty, and a highly reliable electronic component having the bonding structure. A conductive resin composition which includes (a) a curable resin and (b) hard spherical carbon formed by coating the surface of a spherical base carbon particle with fine carbon particles and/or hard spherical carbon formed by coating the surface of a spherical base carbon particle with pitch-derived fine carbon pieces, is used. The conductive resin composition is suppled to a space between areas of at least two works respectively having the areas to be electrically connected to each other, and the conductive resin composition is cured while applying a pressure between the areas.

Abstract translation: 为了提供能够确保高导通可靠性的导电性树脂组合物，使用该组合物制造具有高接合可靠性的电子部件的方法，能够使接合对象物彼此接合的接合方法和接合结构 其他可靠性，以及具有键合结构的高度可靠的电子部件。 一种导电性树脂组合物，其特征在于，含有（a）固化性树脂和（b）球状的基体碳粒子的表面被覆微小的碳粒子和/或将球状的基体碳 使用含有沥青衍生的细碳片的颗粒。 将导电树脂组合物供应到分别具有要彼此电连接的区域的至少两个工件的区域之间的空间中，并且在区域之间施加压力的同时使导电树脂组合物固化。