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公开(公告)号：EP0821468A3
公开(公告)日：1999-03-31
申请号：EP97305322.6
申请日：1997-07-16
发明人： Esser, Albert Andreas Maria , Keister, Lyle Thomas , Lyons, James Patrick , Sutherland, Steven Wade , Hughes, Melvin Lavern , Edmunds, Howard Ross , Nash, Stephen Daniel , Pate, Paul Stephen , McGinn, Patrick Henry , Pecile, Conrad Angelo
CPC分类号： H05K7/20945 , F28D15/0275 , H05K7/20936
摘要： A system for temperature control of an electronic component includes a heat plate (10) supporting the component (18); a heat plate temperature sensor (20), a fan (14) capable of providing air for cooling the heat plate; and a fan control (22) for using the heat plate temperature to control the operation of the fan to provide a substantially constant heat plate temperature. The system can further include a heat pipe assembly (12) having fins and coupled to the heat plate with the fan capable of providing air to the fins. The heat pipe assembly can include at least two heat pipes each having first ends coupled to the heat plate and second ends situated in a condensation section where at least one of the heat pipes has a different working fluid than an other. A switch temperature or load current sensor can be coupled to the heat plate and supply data to a switch controller for receiving the switch temperature, determining whether the temperature or load current has changed, and adjusting a switching frequency of the at least one electronic switch device in response to any change of the switch temperature. A bus layer can be situated adjacent the component and selectively coated with an insulating material and studs can mechanically and electrically coupling the bus layer and a printed circuit board to the component. An insulating shield can be situated between the bus layer and the printed circuit board with the studs.
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2.发明公开System and method for operating an electric power converter 审中-公开系统和Verfahrenfürden Betrieb eines Stromwandlers
公开(公告)号：EP2590211A2
公开(公告)日：2013-05-08
申请号：EP12190602.8
申请日：2012-10-30
IPC分类号： H01L23/427 , H02M7/00
CPC分类号： H01L23/427 , H01L2924/0002 , H02M7/003 , H02M2001/007 , H02M2001/327 , H02S40/345 , H05K7/203 , H05K7/20936 , H01L2924/00
摘要： An electric power converter 104 for a renewable power source 102 includes at least one alternating current (AC) conduit 176,178,180 coupled to an external AC power device 106 and at least one direct current (DC) conduit 114,116,118,132 coupled to an external DC power device 102. The converter also includes at least one immersion structure 222,322 defining at least one immersion cavity 226,326 therein and a plurality of semiconductor devices 200,300. The semiconductor devices include a substrate 204,304 positioned within the immersion cavity. The substrate defines a plurality of heat transfer surfaces 206,207,306,307 thereon. The semiconductor devices also include at least one semiconductor die 202,302 coupled to the substrate, the AC conduit, and the DC conduit. The converter further includes a liquid 228,328 at least partially filling the immersion cavity such that the semiconductor die is fully immersed in and in direct contact with the liquid. Heat 248,348 generated in the semiconductor device induces a phase change in the liquid.
摘要翻译： 用于可再生电源102的电力转换器104包括耦合到外部AC电力设备106和耦合到外部DC电力设备102的至少一个直流（DC）导管114,116,118,132的至少一个交流电（AC）导管176,178,180。 转换器还包括至少一个浸没结构222,322，其中限定了至少一个浸入腔226,326和多个半导体器件200,300。 半导体器件包括位于浸入腔内的衬底204,304。 衬底在其上限定多个传热表面206,207,306,307。 半导体器件还包括耦合到衬底，AC导管和DC导管的至少一个半导体管芯202,302。 转换器还包括至少部分地填充浸入腔的液体228,328，使得半导体管芯完全浸没在液体中并与液体直接接触。 在半导体器件中产生的热248,348引起液体中的相变。
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公开(公告)号：EP2590211A3
公开(公告)日：2018-01-17
申请号：EP12190602.8
申请日：2012-10-30
IPC分类号： H01L23/427 , H02M7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002 , H02M7/003 , H02M2001/007 , H02M2001/327 , H02S40/345 , H05K7/203 , H05K7/20936 , H01L2924/00
摘要： An electric power converter 104 for a renewable power source 102 includes at least one alternating current (AC) conduit 176,178,180 coupled to an external AC power device 106 and at least one direct current (DC) conduit 114,116,118,132 coupled to an external DC power device 102. The converter also includes at least one immersion structure 222,322 defining at least one immersion cavity 226,326 therein and a plurality of semiconductor devices 200,300. The semiconductor devices include a substrate 204,304 positioned within the immersion cavity. The substrate defines a plurality of heat transfer surfaces 206,207,306,307 thereon. The semiconductor devices also include at least one semiconductor die 202,302 coupled to the substrate, the AC conduit, and the DC conduit. The converter further includes a liquid 228,328 at least partially filling the immersion cavity such that the semiconductor die is fully immersed in and in direct contact with the liquid. Heat 248,348 generated in the semiconductor device induces a phase change in the liquid.
摘要翻译： 用于可再生电源102的电力转换器104包括耦合到外部AC电力设备106的至少一个交流（AC）导管176,178,180和耦合到外部DC电力设备102的至少一个直流（DC）导管114,116,118,132。 转换器还包括至少一个浸入结构222,322，其限定至少一个浸入腔226,326和多个半导体器件200,300。 半导体器件包括位于浸没腔内的衬底204,304。 基板在其上限定多个传热表面206,207,306,307。 半导体器件还包括耦合到衬底，AC导管和DC导管的至少一个半导体管芯202,302。 转换器还包括至少部分地填充浸没腔的液体228,328，使得半导体管芯完全浸没在液体中并与液体直接接触。 在半导体器件中产生的热248,348引起液体中的相变。
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公开(公告)号：EP0821468B1
公开(公告)日：2004-03-10
申请号：EP97305322.6
申请日：1997-07-16
发明人： Esser, Albert Andreas Maria , Keister, Lyle Thomas , Lyons, James Patrick , Sutherland, Steven Wade , Hughes, Melvin Lavern , Edmunds, Howard Ross , Nash, Stephen Daniel , Pate, Paul Stephen , McGinn, Patrick Henry , Pecile, Conrad Angelo
CPC分类号： H05K7/20945 , F28D15/0275 , H05K7/20936
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5.发明公开
公开(公告)号：EP0821468A2
公开(公告)日：1998-01-28
申请号：EP97305322.6
申请日：1997-07-16
发明人： Esser, Albert Andreas Maria , Keister, Lyle Thomas , Lyons, James Patrick , Sutherland, Steven Wade , Hughes, Melvin Lavern , Edmunds, Howard Ross , Nash, Stephen Daniel , Pate, Paul Stephen , McGinn, Patrick Henry , Pecile, Conrad Angelo
CPC分类号： H05K7/20945 , F28D15/0275 , H05K7/20936
摘要： A system for temperature control of an electronic component includes a heat plate (10) supporting the component (18); a heat plate temperature sensor (20), a fan (14) capable of providing air for cooling the heat plate; and a fan control (22) for using the heat plate temperature to control the operation of the fan to provide a substantially constant heat plate temperature. The system can further include a heat pipe assembly (12) having fins and coupled to the heat plate with the fan capable of providing air to the fins. The heat pipe assembly can include at least two heat pipes each having first ends coupled to the heat plate and second ends situated in a condensation section where at least one of the heat pipes has a different working fluid than an other. A switch temperature or load current sensor can be coupled to the heat plate and supply data to a switch controller for receiving the switch temperature, determining whether the temperature or load current has changed, and adjusting a switching frequency of the at least one electronic switch device in response to any change of the switch temperature. A bus layer can be situated adjacent the component and selectively coated with an insulating material and studs can mechanically and electrically coupling the bus layer and a printed circuit board to the component. An insulating shield can be situated between the bus layer and the printed circuit board with the studs.
摘要翻译： 电子部件的温度控制系统包括支撑部件（18）的加热板（10）。 热板温度传感器（20），能够提供用于冷却加热板的空气的风扇（14）; 以及风扇控制器（22），用于使用加热板温度来控制风扇的操作以提供基本恒定的加热板温度。 该系统还可以包括具有翅片并且耦合到加热板的热管组件（12），其中风扇能够向散热片提供空气。 热管组件可以包括至少两个热管，每个热管具有联接到加热板的第一端和位于冷凝部分中的第二端，其中至少一个热管具有与另一个不同的工作流体。 开关温度或负载电流传感器可以耦合到加热板，并将数据提供给开关控制器以接收开关温度，确定温度或负载电流是否已经改变，以及调整至少一个电子开关器件的开关频率 响应于开关温度的任何变化。 总线层可以位于相邻的部件并且选择性地涂覆有绝缘材料，并且螺柱可以将总线层和印刷电路板机械地和电耦合到部件。 绝缘屏蔽可以位于总线层和具有螺柱的印刷电路板之间。
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