摘要:
A differential eddy current probe (100) for inspecting a component (52), said eddy current probe comprising: a body portion (102) comprising an outer surface (104) and having a width (106), and a length (108) that is longer than said width; a tip portion (110) extending from said body portion, said tip portion comprising an end (112) and an outer tip (114), said end extending between said body portion and said outer tip, said tip portion having a width (116) and a length (118), said tip portion width gradually decreases from said tip portion end to said outer tip, said tip portion length gradually decreases from said tip portion end to said outer tip; and at least one differential pair of coils (130,132) mounted within said tip portion, each of said at least one pair of coils comprises a substantially cylindrical shape, at least a portion of each of said at least one pair of coils is positioned adjacent to said tip portion outer tip for generating a magnetic field that is substantially perpendicular to a surface of the component being inspected.
摘要:
An article (108) and method for laser shock peening (LSP) the article (108) to form pairs (88) of longitudinally spaced apart (LD) first and second laser shock peened spots (158, 159) that are on opposite sides of the article (108), simultaneously laser shock peened, and transversely offset (OS) from each other.
摘要:
An eddy current inspection system is provided. The eddy current inspection system includes an eddy current probe (70), and a computer (78) coupled to the eddy current probe. The computer is configured to generate (102) a raw image of a component (52) under test, decompose (104) the raw image into a plurality of images, each image including a different frequency component, and reconstruct (106) at least one final image of the component that includes frequency components that are relevant to an eddy current flaw signal.
摘要:
A differential eddy current probe (100) for inspecting a component (52), said eddy current probe comprising: a body portion (102) comprising an outer surface (104) and having a width (106), and a length (108) that is longer than said width; a tip portion (110) extending from said body portion, said tip portion comprising an end (112) and an outer tip (114), said end extending between said body portion and said outer tip, said tip portion having a width (116) and a length (118), said tip portion width gradually decreases from said tip portion end to said outer tip, said tip portion length gradually decreases from said tip portion end to said outer tip; and at least one differential pair of coils (130,132) mounted within said tip portion, each of said at least one pair of coils comprises a substantially cylindrical shape, at least a portion of each of said at least one pair of coils is positioned adjacent to said tip portion outer tip for generating a magnetic field that is substantially perpendicular to a surface of the component being inspected.
摘要:
An eddy current (EC) probe (12) for inspecting a component (16) is provided. The EC probe includes a drive coil (30) configured to generate a probing field for inducing eddy currents (18) in the component, where a portion of the eddy currents is aligned parallel to an edge (38) of the component. The EC probe further includes a pair of sense coils (34), where an axis of the sense coils is aligned perpendicular to the surface (14) of the component. The sense coils are configured to sense the portion of the eddy currents aligned parallel to the edge of the component.
摘要:
A method for laser shock peening (LSP) an article (108) by simultaneously firing low energy first and second laser beams (102, 103) to form pairs of longitudinally spaced apart first and second laser shock peened spots (one shown at 158) that are on opposite sides of the article (108), simultaneously laser shock peened, and transversely offset from each other. Each of the low energy first and second laser beams (102, 103) have a level of energy of between 1-10 joules.
摘要:
A method for quality control testing of a laser shock peening process of a production workpiece (108) includes (a) ultrasonically scanning (30,32) at least a portion of a laser shock peened surface on the workpiece (108) wherein a region having deep compressive residual stresses imparted by the laser shock peening process extends into the workpiece (108) from the laser shock peened surface, (b) digitizing (42) a signal derived from the scanning and forming a digitized image of intensity values from the scanning, (c) calculating at least one statistical function value for a plurality of points of the digitized image of the workpiece (108) based on the intensity values, and (d) comparing the statistical function value to a pass or fail criteria for quality assurance of the laser shock peening process or accepting or rejecting the workpiece (108).
摘要:
A method for detecting small cracks (40) and other anomalies on parts (32) having complex geometries is described. The method includes eddy current inspection incorporating collection of data from multi-frequency eddy current signals. Phase analysis is used to combine the multi-frequency data to enhance the signal to noise ratio of the raw inspection image. The image is then reprocessed using a spatiotemporal filter to correlate with the frequency components of the eddy current flaw signal to separate signals associated with cracks and other flaws at edges (34) that would ordinarily be hidden by edge effect signals.
摘要:
A method for generating a scanplan for inspection of a component is provided. The method includes loading a geometric model (46) of the component and generating the scanplan of the component based on the geometric model (46) and at least one scanning parameter. A method of inspecting a component is also provided and includes loading a geometric model (46) of the component, generating a scanplan of the component based on the geometric model (46) and at least one scanning parameter, mounting the component on an inspection system manipulator and inspecting the component including moving an inspection probe relative to the component using the scanplan.