OLED DEVICE WITH SHORT REDUCTION LAYER
    1.
    发明公开
    OLED DEVICE WITH SHORT REDUCTION LAYER 审中-公开
    OLED-VORRICHTUNG MIT KURZER REDUKTIONSSCHICHT

    公开(公告)号:EP2248204A1

    公开(公告)日:2010-11-10

    申请号:EP09718565.6

    申请日:2009-02-20

    发明人: WINTERS, Dustin

    IPC分类号: H01L51/52 H01L51/56 H01L51/00

    摘要: A method of making an OLED device includes providing a substrate having a first electrode into a controlled environment; baking the substrate in the controlled environment to remove moisture; forming an inorganic short reduction layer over the moisture reduced substrate in the controlled environment after baking the substrate, such short reduction layer having a resistivity greater than the resistivity of the first electrode; forming an organic electroluminescent media over the moisture reduced substrate in the controlled environment; forming a second electrode over the organic electroluminescent media in the controlled environment wherein the OLED device is formed; and encapsulating the OLED device.

    摘要翻译: 制造OLED器件的方法包括将具有第一电极的衬底提供到受控环境中; 在受控环境中烘烤基材以除去水分; 在烘烤所述基板之后,在所述受控环境中的所述减湿基板上形成无机短缩合层,所述短路还原层的电阻率大于所述第一电极的电阻率; 在受控环境中的水分减少的基底上形成有机电致发光介质; 在其中形成有OLED器件的受控环境中在有机电致发光介质上形成第二电极; 并封装OLED器件。

    DEVICE WITH CHIPLETS AND ADAPTABLE INTERCONNECTIONS
    2.
    发明公开
    DEVICE WITH CHIPLETS AND ADAPTABLE INTERCONNECTIONS 有权
    具有可调小芯片和连接设备

    公开(公告)号:EP2351086A1

    公开(公告)日:2011-08-03

    申请号:EP09745159.5

    申请日:2009-11-03

    IPC分类号: H01L27/32

    CPC分类号: H01L27/3276 H01L27/3255

    摘要: An active-matrix device includes a device substrate including a plurality of pixels formed thereon, each pixel having a separate control electrode, a plurality of chiplets having at least first and second corresponding chiplets disposed at different locations over the device substrate, a plurality of wires formed over the device substrate, each wire being connected to a connection pad and to a different pixel control electrode, and wherein the shape of at least one of the wires connecting a connection pad for the first chiplet is different from the shape of at least one of the wires connecting a corresponding connection pad for the second chiplet.