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公开(公告)号：EP3235587A4
公开(公告)日：2018-05-02
申请号：EP15869567
申请日：2015-02-24
Applicant: HARIMA CHEMICALS INC
Inventor： IKEDA KAZUKI , INOUE KOSUKE , ICHIKAWA KAZUYA , TAKEMOTO TADASHI
CPC classification number: B23K35/262 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/3006 , C22C1/06 , C22C13/00 , C22C13/02
Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt. Relative to a total amount of the solder alloy, the silver content is 2 mass% or more and 4 mass% or less, the copper content is 0.3 mass% or more and 1 mass% or less, the bismuth content is more than 4.8 mass% and 10 mass% or less, the antimony content is 3 mass% or more and 10 mass% or less, the cobalt content is 0.001 mass% or more and 0.3 mass% or less, and the tin content is the remaining portion.
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公开(公告)号：EP3093098A4
公开(公告)日：2017-12-13
申请号：EP14853188
申请日：2014-08-28
Applicant: HARIMA CHEMICALS INC
Inventor： IKEDA KAZUKI , INOUE KOSUKE , ICHIKAWA KAZUYA , TAKEMOTO TADASHI
CPC classification number: B23K35/262 , B23K35/0205 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/36 , B23K35/3606 , B23K35/3612 , B23K35/3613 , B23K35/3616 , B23K35/3618 , B23K35/362 , B23K2201/36 , B23K2201/42 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3484
Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass% or more and 4 mass% or less; the content ratio of the indium is 6.2 mass% or more and 9.0 mass% or less; the content ratio of the bismuth is 0.7 mass% or more and 5.0 mass% or less; the content ratio of the antimony is 0.3 mass% or more and 5.0 mass% or less; and the content ratio of the tin is the remaining ratio and the value of A in the discriminant (1) is 4.36 or less. A = 0.87 × In content ratio mass % ˆ’ 0.41 × Ag content ratio mass % ˆ’ 0.82 × Sb content ratio mass %
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公开(公告)号：EP2979807A4
公开(公告)日：2016-12-07
申请号：EP14863041
申请日：2014-08-28
Applicant: HARIMA CHEMICALS INC
Inventor： IKEDA KAZUKI , INOUE KOSUKE , ICHIKAWA KAZUYA , TAKEMOTO TADASHI
CPC classification number: B23K35/262 , B23K35/0205 , B23K35/0227 , B23K35/0244 , B23K35/025 , B23K35/22 , B23K35/26 , B23K35/36 , B23K35/3606 , B23K35/3612 , B23K35/3613 , B23K35/3616 , B23K35/3618 , B23K35/362 , B23K2201/36 , B23K2201/42 , C22C13/00 , C22C13/02 , H05K3/3457 , H05K3/3484
Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass% or more and 4 mass% or less; the content ratio of the indium is 6.2 mass% or more and 9.0 mass% or less; the content ratio of the bismuth is 0.7 mass% or more and 5.0 mass% or less; the content ratio of the antimony is 0.3 mass% or more and 5.0 mass% or less; and the content ratio of the tin is the remaining ratio and the value of A in the discriminant (1) is 4.36 or less. A = 0.87 × In content ratio mass % ˆ’ 0.41 × Ag content ratio mass % ˆ’ 0.82 × Sb content ratio mass %
Abstract translation: 焊料合金基本上由锡，银，铟，铋和锑构成。 关于焊料合金的总量，银的含量比为2.8质量％以上且4质量％以下; 铟的含量比为6.2质量％以上至9.0质量％以下; 铋的含有比例为0.7质量％以上至5.0质量％以下; 锑的含量比为0.3质量％以上至5.0质量％以下; 锡的含量比为剩余率，判别式（1）中的A的值为4.36以下。 A = 0.87×含量比质量％'0.41×Ag含量比质量％'0.82×Sb含量比质量％
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公开(公告)号：EP2875898A4
公开(公告)日：2016-07-06
申请号：EP13819569
申请日：2013-06-25
Applicant: HARIMA CHEMICALS INC
Inventor： NAKANISHI KENSUKE , INOUE KOSUKE , ICHIKAWA KAZUYA , SHIGESADA TETSUYUKI , TAKEMOTO TADASHI
CPC classification number: H05K3/3457 , B23K35/025 , B23K35/262 , C22C13/00 , C22C13/02 , H05K1/092 , H05K3/3463 , H05K3/3484
Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass% or more and 4 mass% or less, the nickel content is 0.01 mass% or more and 0.15 mass% or less, and the cobalt content is 0.001 mass% or more and 0.008 mass% or less.
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