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    COMPONENT INSPECTION APPARATUS AND COMPONENT MOUNTING SYSTEM HAVING SAME
    1.
    发明公开
    COMPONENT INSPECTION APPARATUS AND COMPONENT MOUNTING SYSTEM HAVING SAME 审中-公开

    公开(公告)号：EP3223594A4

    公开(公告)日：2018-07-04

    申请号：EP15860117

    申请日：2015-11-20

    Applicant: KOH YOUNG TECH INC

    Inventor： KIM JEONG-YEOB

    IPC: H05K13/04 ,  B23K3/08 ,  B23K101/42 ,  H05K13/08

    CPC classification number: H05K13/08 ,  B23K3/08 ,  B23K2201/42 ,  H05K13/04

    Abstract: A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.

    SOLDERING APPARATUS
    3.
    发明公开
    SOLDERING APPARATUS 审中-公开

    公开(公告)号：EP3264871A4

    公开(公告)日：2018-03-14

    申请号：EP15883187

    申请日：2015-02-25

    Applicant: FUJI MACHINE MFG

    Inventor： TANAKA KATSUNORI ,  HAMANE TSUYOSHI

    IPC: H05K3/34 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42

    CPC classification number: B23K3/00 ,  B23K1/012 ,  B23K1/08 ,  B23K3/0607 ,  B23K3/0669 ,  B23K2201/42 ,  H05K3/34 ,  H05K3/3447 ,  H05K2203/0475 ,  H05K2203/049

    Abstract: An object of the invention is to provide a soldering apparatus that moves the soldering apparatus at a rapid speed while ensuring that molten solder does not spill to the outside of a jet nozzle. A semiconductor device disclosed in the present description includes a solder tank that stores the molten solder, a jetting mechanism that has the jet nozzle, which extends upwards from the solder tank toward a holding surface, and a pump, which pumps the molten solder stored in the solder tank, and that jets the molten solder from the jet nozzle toward the holding surface by the pump being driven, an XY-direction moving mechanism that moves the solder tank in an X-direction and a Y-direction, which are parallel to the holding surface, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank such that the molten solder does not spill to the outside of the jet nozzle, when the XY-direction moving mechanism is driven to move the solder tank in the X-direction and/or the Y-direction.

    NOZZLE FOR HEATING DEVICE, HEATING DEVICE, AND NOZZLE FOR COOLING DEVICE
    9.
    发明公开
    NOZZLE FOR HEATING DEVICE, HEATING DEVICE, AND NOZZLE FOR COOLING DEVICE 审中-公开
    DÜSEFÜREINE ERHITZUNGSVORRICHTUNG，ERHITZUNGSVORGHHTUNG UNDDÜSEFÜREINEKÜHLVORRICHTUNG

    公开(公告)号：EP2463050A4

    公开(公告)日：2017-06-28

    申请号：EP10818625

    申请日：2010-08-03

    Applicant: SENJU METAL INDUSTRY CO

    Inventor： KAGAYA TOMOTAKE

    IPC: B23K3/08 ,  B23K1/00 ,  B23K1/008 ,  B23K101/36 ,  B23K101/42 ,  H05K3/34

    CPC classification number: B23K1/008 ,  B23K1/0016 ,  B23K3/08 ,  B23K2201/42 ,  H05K3/3494

    Abstract: To achieve an improvement of heat exchanger effectiveness (heat transfer rate) without any increase of a fan motor output. The gas heated by the heating units or the gas cooled down by the cooling units is sent to the blowing nozzles 2 by a fan. Then, the blowing nozzles 2 blow the gas sent by the fan through their outlets. Each of the outlets has a non-circular planar shape with a projection portion thereof being projected inwardly. This allows a shape of the gas in cross section perpendicular to a direction where the gas is blown through the outlet of each of the blowing nozzles 2 to be changed by the projection portion with time (switching phenomenon) . Such a stitching phenomenon enables to be increased the heat exchanger effectiveness (heat transfer rate) on the printed board even if any output of the fan motor for rotating the fan does not increase.

    Abstract translation: 为了在不增加风扇电机输出的情况下提高热交换器效率（传热率）。 被加热单元加热的气体或被冷却单元冷却的气体被风扇送到吹气喷嘴2。 然后，吹风喷嘴2将风扇送出的气体通过其出口吹出。 每个出口具有非圆形的平面形状，其突出部分向内突出。 由此，能够使与吹出喷嘴2的吹出口的气体的吹出方向垂直的截面的气体的形状随着时间经过突出部而变化（切换现象）。 即使用于旋转风扇的风扇电机的任何输出不增加，这样的拼接现象也能够提高印刷板上的热交换器效率（热传递率）。

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