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公开(公告)号:EP2223771A4
公开(公告)日:2012-09-26
申请号:EP08855551
申请日:2008-11-25
Applicant: HARIMA CHEMICALS INC
Inventor: ISHIKAWA SHUNSUKE , SHINOZUKA AKIRA , AIHARA MASAMI
IPC: B23K35/363 , B23K35/02 , B23K35/362 , H05K3/34
CPC classification number: B23K35/3613 , B23K35/0244 , B23K35/025 , B23K35/362 , B23K2201/36 , H05K3/3489
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2.FLUX FOR SOLDERING, SOLDERING PASTE COMPOSITION, AND METHOD OF SOLDERING 有权
Title translation: 助焊剂焊接锡膏焊接和公开(公告)号:EP2221140A4
公开(公告)日:2011-08-03
申请号:EP08854783
申请日:2008-11-25
Applicant: HARIMA CHEMICALS INC
Inventor: ISHIKAWA SHUNSUKE , SHINOZUKA AKIRA , AIHARA MASAMI
IPC: B23K35/363 , B23K35/02 , B23K35/36 , B23K35/362 , H05K3/34
CPC classification number: B23K35/362 , B23K35/0244 , B23K35/025 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/3618 , H05K3/3489
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