公开(公告)号：EP1807248B1

公开(公告)日：2008-06-25

申请号：EP05796324.1

申请日：2005-10-11

申请人： HEINRICH KUPER GMBH & CO. KG

发明人： RUNGE, Carsten ,  LINN, Horst ,  SUHM, Jürgen

IPC分类号： B27D1/10 ,  H05B6/78 ,  H05B6/80

CPC分类号： H05B6/708 ,  B27D1/10 ,  H05B6/705 ,  H05B6/78

摘要： The invention relates to a device for joining thin, flat elements (12a, 12b) by means of an adhesive, comprising a transport unit (9) which is used to transport the flat elements (12a, 12b) through the device, and a device (2) for producing microwaves in order to harden an adhesive which is applied to the edges of the flat elements (12a, 12b). The invention is characterised in that the microwaves are guided into a wave guide (3) which comprises at least one slot (4). The butt joint (13) of the flat elements (12a, 12b) comprising the adhesive can be guided past the slit (4) in order to harden the adhesive by means of the microwaves emerging from the slit (4). The invention also relates to a method for joining thin, flat elements.

公开(公告)号：EP1807248A1

公开(公告)日：2007-07-18

申请号：EP05796324.1

申请日：2005-10-11

申请人： HEINRICH KUPER GMBH & CO. KG

发明人： RUNGE, Carsten ,  LINN, Horst ,  SUHM, Jürgen

IPC分类号： B27D1/10 ,  H05B6/78 ,  H05B6/80

CPC分类号： H05B6/708 ,  B27D1/10 ,  H05B6/705 ,  H05B6/78

摘要： The invention relates to a device for joining thin, flat elements (12a, 12b) by means of an adhesive, comprising a transport unit (9) which is used to transport the flat elements (12a, 12b) through the device, and a device (2) for producing microwaves in order to harden an adhesive which is applied to the edges of the flat elements (12a, 12b). The invention is characterised in that the microwaves are guided into a wave guide (3) which comprises at least one slot (4). The butt joint (13) of the flat elements (12a, 12b) comprising the adhesive can be guided past the slit (4) in order to harden the adhesive by means of the microwaves emerging from the slit (4). The invention also relates to a method for joining thin, flat elements.

摘要翻译： 本发明涉及一种用于通过粘合剂连接薄的扁平元件（12a，12b）的装置，该装置包括用于将扁平元件（12a，12b）输送穿过该装置的输送单元（9），以及装置 （2），用于产生微波以硬化施加到扁平元件（12a，12b）的边缘上的粘合剂。 本发明的特征在于微波被引导到包括至少一个槽（4）的波导（3）中。 包括粘合剂的扁平元件（12a，12b）的对接接头（13）可以被引导经过狭缝（4），以便通过从狭缝（4）中出现的微波来硬化粘合剂。 本发明还涉及用于连接薄的扁平元件的方法。