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11 条记录 (耗时 0.012 秒)

    Thermal head for thermal printer
    3.
    发明公开
    Thermal head for thermal printer 失效
    热敏打印头的热敏打印机。

    公开(公告)号：EP0182133A2

    公开(公告)日：1986-05-28

    申请号：EP85113398.3

    申请日：1985-10-22

    申请人： HITACHI, LTD.

    发明人： Higeta, Kazuya ,  Daikoku, Takahiro ,  Fujioka, Kazumasa ,  Nakajima, Isao

    IPC分类号： B41J2/315

    CPC分类号： B41J2/36

    摘要： @ In order to adapt a thermal head for a thermal printer to a raised speed, the thickness 8 (µm) of a heat accumulating layer in the head is set at: where k: temperature conductivity of the heat accumulating layer,

    tp: heating duration of the thermal head, and
    to: printing cycle of the thermal head.

    Heat-pipe type cooling apparatus
    7.
    发明公开
    Heat-pipe type cooling apparatus 失效
    KühlungsapparatvomWärmerohrtyp。

    公开(公告)号：EP0661741A1

    公开(公告)日：1995-07-05

    申请号：EP94120127.9

    申请日：1994-12-19

    申请人： HITACHI, LTD.

    发明人： Suzuki, Osamu ,  Kuwahara, Heikichi ,  Fujioka, Kazumasa ,  Saitoo, Syuuji ,  Suzuki, Nobuo ,  Isaka, Koichi

    IPC分类号： H01L23/427

    CPC分类号： F28D15/0275 ,  F28F1/32 ,  F28F2215/04 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00

    摘要： A cooling apparatus having a plurality of heat pipes (1a,1b) is improved to reduce the condensation capacity of selected heat pipes when ambient air temperature is low, so as to facilitate start-up of the cooling apparatus from a state in which the working fluid (5) in the heat pipes has been frozen. The cooling apparatus has a block (3) of a high heat conductivity in which one end of each heat pipe serving as an evaporation section of the heat pipe is embedded. Heat radiation fins (2a,2b) are attached to portions of the heat pipes exposed from the block, so that the exposed portions of the heat pipes serve as condensation sections of the respective heat pipes. There are two types of heat radiation fins: a first type fins (2a) which are attached to all the heat pipes and a second type fins (2b) which are attached only to selected heat pipes.

    摘要翻译： 改善了具有多个热管（1a，1b）的冷却装置，以在周围空气温度低时降低所选热管的冷凝能力，以便于冷却装置从工作状态 热管中的流体（5）已被冷冻。 冷却装置具有高导热性的块（3），其中嵌入用作热管的蒸发部的每个热管的一端。 热辐射翅片（2a，2b）附着在从块体露出的热管的部分上，使得热管的暴露部分作为各热管的冷凝部分。 有两种类型的散热翅片：附着在所有热管上的第一类翅片（2a）和仅安装在选定热管上的第二型翅片（2b）。

    Cooling apparatus for electronic elements
    8.
    发明公开
    Cooling apparatus for electronic elements 失效
    电子元件的冷却装置

    公开(公告)号：EP0577099A3

    公开(公告)日：1994-03-16

    申请号：EP93110438.4

    申请日：1993-06-30

    申请人： HITACHI, LTD.

    发明人： Kuwahara, Heikichi ,  Fujioka, Kazumasa ,  Takasaki, Toshio ,  Saitoo, Syuuji ,  Toyota, Eiichi

    IPC分类号： H01L23/367 ,  H01L23/40 ,  H01L23/427

    CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L25/072 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00

    摘要： A cooling apparatus (10) for electronic device comprises an electronic element unit (11) which comprises a base member (14), a thermal conductive electric insulating layer (15) soldered to the base member (14) and a plurality of electronic elements (16) soldered to the thermal conductive electric insulating layer (15); at least one cooling unit (12) which is detachably kept in pressure contact with the base member (14) of the electronic element unit (11) and comprises a cooling block (19), at least one heat pipe (21) having a refrigerant (22) sealingly contained therein and inserted in the cooling block (19) at one end thereof and a plurality of radiation fins (23) provided at the other end of the at least one heat pipe (21); and a device (13) which serves to detachably keep the electronic element unit (11) and the cooling unit (12) in pressure contact with each other. The other end of the heat pipe (21) extends obliquely with a predetermined angle (α) with respect to the inserted portion thereof.

    摘要翻译： 一种用于电子设备的冷却装置（10）包括电子元件单元（11），该电子元件单元包括基座构件（14），焊接到基座构件（14）的导热电绝缘层（15）和多个电子元件 16）焊接至所述导热电绝缘层（15）; 至少一个与电子元件单元（11）的基座构件（14）可拆卸地保持压力接触的冷却单元（12），并包括冷却块（19）;至少一个热管（21），其具有制冷剂 （22）密封地容纳在其中并且在其一端插入到冷却块（19）中并且在所述至少一个热管（21）的另一端设置有多个散热片（23）; 和用于将电子元件单元（11）和冷却单元（12）可拆卸地保持在彼此压力接触的装置（13）。 热管（21）的另一端相对于其插入部分以预定角度（α）倾斜延伸。

    Cooling apparatus for electronic elements
    9.
    发明公开
    Cooling apparatus for electronic elements 失效
    Kühlvorrichtungfürelektronische Elemente。

    公开(公告)号：EP0577099A2

    公开(公告)日：1994-01-05

    申请号：EP93110438.4

    申请日：1993-06-30

    申请人： HITACHI, LTD.

    发明人： Kuwahara, Heikichi ,  Fujioka, Kazumasa ,  Takasaki, Toshio ,  Saitoo, Syuuji ,  Toyota, Eiichi

    IPC分类号： H01L23/367 ,  H01L23/40 ,  H01L23/427

    CPC分类号： H01L23/427 ,  F28D15/0275 ,  H01L25/072 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00

    摘要： A cooling apparatus (10) for electronic device comprises an electronic element unit (11) which comprises a base member (14), a thermal conductive electric insulating layer (15) soldered to the base member (14) and a plurality of electronic elements (16) soldered to the thermal conductive electric insulating layer (15); at least one cooling unit (12) which is detachably kept in pressure contact with the base member (14) of the electronic element unit (11) and comprises a cooling block (19), at least one heat pipe (21) having a refrigerant (22) sealingly contained therein and inserted in the cooling block (19) at one end thereof and a plurality of radiation fins (23) provided at the other end of the at least one heat pipe (21); and a device (13) which serves to detachably keep the electronic element unit (11) and the cooling unit (12) in pressure contact with each other. The other end of the heat pipe (21) extends obliquely with a predetermined angle (α) with respect to the inserted portion thereof.

    摘要翻译： 一种用于电子设备的冷却设备（10）包括电子元件单元（11），其包括基底构件（14），焊接到基座构件（14）的导热电绝缘层（15）和多个电子元件 16）焊接到导热电绝缘层（15）上; 至少一个冷却单元（12），其可拆卸地保持与所述电子元件单元（11）的基座构件（14）压力接触并且包括冷却块（19），至少一个具有制冷剂的热管（21） （22），密封地容纳在其中并在其一端插入冷却块（19）和设置在至少一个热管（21）的另一端的多个散热片（23）; 以及用于可拆卸地保持电子元件单元（11）和冷却单元（12）彼此压力接触的装置（13）。 热管（21）的另一端相对于其插入部分以预定角度（α）倾斜延伸。

    Thermal Head
    10.
    发明公开
    Thermal Head 失效
    热敏头

    公开(公告)号：EP0146870A3

    公开(公告)日：1987-08-05

    申请号：EP84115180

    申请日：1984-12-11

    申请人： HITACHI, LTD.

    发明人： Higeta, Kazuya ,  Fujioka, Kazumasa ,  Nemoto, Takeo ,  Daikoku, Takahiro ,  Nakajima, Isao

    IPC分类号： B41J03/20

    CPC分类号： B41J2/345

    摘要： A thermal head comprises a heat accumulating member (2) disposed on a substrate (1), a plurality of heating resistors (3) juxtaposed on the heat accumulating member (2) in a manner to be spaced from each other, electrodes (4) for supplying electric power to the heating resistors (3), and a protective member (5) for preventing oxidation and wear of the heating resistors (3) and the electrodes (4), these constituents being formed as layers. When the electric power is supplied to the electrodes (4), heat is generated by a heating portion (3a) of the heating resistor (3) corresponding to the electrodes (4), and it is transmitted to a head surface (6a) via a thermally conductive member (7) disposed in a printing dot portion (6a) of the protective member (5). The heat from the printing dot portion (6a) is used for effecting printing on a medium to-be-recorded through a thermosensitive sheet (9) which lies in contact with the head surface (6a).

    摘要翻译： 本发明提供一种热敏头，其包括：设置在基板（1）上的蓄热部件（2）;以与蓄热部件（2）隔开间隔的方式并列设置的多个发热电阻体（3）;电极（4） 用于向加热电阻器（3）供电，以及用于防止加热电阻器（3）和电极（4）氧化和磨损的保护部件（5），这些部件形成为层。 当向电极（4）提供电力时，由与电极（4）相对应的加热电阻器（3）的加热部分（3a）产生热量，并且其经由电极（4）传递到头表面（6a） 设置在保护部件（5）的印刷点部分（6a）中的导热部件（7）。 来自印刷点部分（6a）的热量用于通过与头部表面（6a）接触的热敏片（9）在要被记录的介质上进行印刷。