摘要:
The invention provides a power conversion device capable of cooling the power semiconductors efficiently and downsizing the device. The power conversion device comprises a plurality of power semiconductor devices, a heat receiving member, a plurality of heat pipes and a plurality of heat radiating fins, wherein the plurality of semiconductor devices are attached to one side of the heat receiving member, and the plurality of heat pipes are attached to the other side of the heat receiving member, the plurality of heat pipes have heat receiving sections thermally connected to the heat receiving member, and a portion of the plurality of heat pipes has heat radiating sections erected from both ends of the heat receiving section, and another portion of the plurality of heat pipes has a heat radiating section erected from only one side of the heat receiving section, the plurality of heat radiating fins are disposed on the heat radiating sections of the plurality of heat pipes, and the pipes composing the heat radiating sections of the heat pipes are arranged in a zigzag manner.
摘要:
The invention provides a power conversion device capable of cooling the power semiconductors efficiently and downsizing the device. The power conversion device comprises a plurality of power semiconductor devices, a heat receiving member, a plurality of heat pipes and a plurality of heat radiating fins, wherein the plurality of semiconductor devices are attached to one side of the heat receiving member, and the plurality of heat pipes are attached to the other side of the heat receiving member, the plurality of heat pipes have heat receiving sections thermally connected to the heat receiving member, and a portion of the plurality of heat pipes has heat radiating sections erected from both ends of the heat receiving section, and another portion of the plurality of heat pipes has a heat radiating section erected from only one side of the heat receiving section, the plurality of heat radiating fins are disposed on the heat radiating sections of the plurality of heat pipes, and the pipes composing the heat radiating sections of the heat pipes are arranged in a zigzag manner.
摘要:
The invention provides a battery module and a railwayvehicle (1000a, 1000b), wherein the structure of the battery module (1110) can be switched easily between a draft structure and an enclosed structure in response to the specifications of a system, and a high-performance cooling structure making use of the respective structures is enabled regardless of which cooling structure is selected. A package of battery modules (1110) in which multiple battery cells (1111) are arranged in parallel has openings (1112) formed on a pair of side panels of the package throughwhich the side walls of the battery cells 1111 are exposed. Further, either cooling ducts (1118) for letting ambient cooling air flow therethrogh or cover plates (1115) for sealing the package of the battery modules (1110) are selectively attached to openings (1112). The cover plates (1115) have heat absorbing blocks (1113) disposed on the inner side thereof for thermally coming into contact with the side walls of the battery cells (1111), and radiating fins (1114) disposed on the outer side thereof.
摘要:
When battery equipment is applied to a drive system of a railway vehicle, a high voltage needs to be produced and the safety during assembly needs to be secured, and therefore the battery equipment needs to be downsized so as to be mounted in a limited space of the railway vehicle. The present invention provides battery equipment for a railway vehicle including a plurality of battery modules 11, each of which stores a plurality of lithium-ion cells, a battery module storage section 1 that stores the plurality of battery modules, a control section 2 that detects conditions of the plurality of battery modules and controls charge and discharge thereof and a case 3 that allows the battery module storage section and the control section to be juxtaposed in a traveling direction of the vehicle.
摘要:
A liquid cooling system for use in an electronic apparatus, being super small-sized and thin in the shape and being suitable for cooling a heat-generation part, such as, a semiconductor element having large amount of heat generation, for example, with maintaining the corrosion resistance thereof for a long time period, comprises: a pump (1) for supplying a cooling liquid; a heat-receiving jacket (2), being supplied with the cooling liquid, for receiving heat from an electronic parts; a radiator, being supplied with the cooling liquid passing through the heat-receiving jacket, for radiation heat; and flow passages for circulating the cooling liquid in a route passing through the radiator back to said pump, wherein an ion exchange bag (9), having an ion exchange resin (11) and a bag enclosing it therein, is disposed in a part of the constituent parts of the liquid cooling system, and/or the ion exchange bag (9) is exchangeable.
摘要:
A cooling apparatus having a plurality of heat pipes (1a,1b) is improved to reduce the condensation capacity of selected heat pipes when ambient air temperature is low, so as to facilitate start-up of the cooling apparatus from a state in which the working fluid (5) in the heat pipes has been frozen. The cooling apparatus has a block (3) of a high heat conductivity in which one end of each heat pipe serving as an evaporation section of the heat pipe is embedded. Heat radiation fins (2a,2b) are attached to portions of the heat pipes exposed from the block, so that the exposed portions of the heat pipes serve as condensation sections of the respective heat pipes. There are two types of heat radiation fins: a first type fins (2a) which are attached to all the heat pipes and a second type fins (2b) which are attached only to selected heat pipes.
摘要:
The invention provides a power conversion device capable of cooling the power semiconductors efficiently and downsizing the device. The power conversion device comprises a plurality of power semiconductor devices, a heat receiving member, a plurality of heat pipes and a plurality of heat radiating fins, wherein the plurality of semiconductor devices are attached to one side of the heat receiving member, and the plurality of heat pipes are attached to the other side of the heat receiving member, the plurality of heat pipes have heat receiving sections thermally connected to the heat receiving member, and a portion of the plurality of heat pipes has heat radiating sections erected from both ends of the heat receiving section, and another portion of the plurality of heat pipes has a heat radiating section erected from only one side of the heat receiving section, the plurality of heat radiating fins are disposed on the heat radiating sections of the plurality of heat pipes, and the pipes composing the heat radiating sections of the heat pipes are arranged in a zigzag manner.