公开(公告)号：EP0162290B1

公开(公告)日：1989-01-11

申请号：EP85104682.1

申请日：1985-04-18

申请人： HITACHI, LTD.

发明人： Takasaki, Mitsuhiro ,  Murakami, Hiroya

IPC分类号： B26F1/38

CPC分类号： H05K3/005 ,  B26F1/02 ,  B26F2210/08 ,  B28B11/12 ,  H05K1/0306 ,  H05K3/0008 ,  H05K2203/0195 ,  Y10T83/0572 ,  Y10T83/0577 ,  Y10T83/175 ,  Y10T83/2079 ,  Y10T83/4604 ,  Y10T83/654 ,  Y10T83/8743

公开(公告)号：EP0162290A1

公开(公告)日：1985-11-27

申请号：EP85104682.1

申请日：1985-04-18

申请人： HITACHI, LTD.

发明人： Takasaki, Mitsuhiro ,  Murakami, Hiroya

IPC分类号： B26F1/38

CPC分类号： H05K3/005 ,  B26F1/02 ,  B26F2210/08 ,  B28B11/12 ,  H05K1/0306 ,  H05K3/0008 ,  H05K2203/0195 ,  Y10T83/0572 ,  Y10T83/0577 ,  Y10T83/175 ,  Y10T83/2079 ,  Y10T83/4604 ,  Y10T83/654 ,  Y10T83/8743

摘要： @ A punching method and apparatus is used in the formation of through holes by punching in a ceramic green sheet for use as the material of a laminated substrate. According to the punching method of the invention, not only the positioning of the work (12) but also the driving of the upper die set (11) are conducted by means of servomotors (1, 15, 18). The speeds and timings of operation of these servomotors are controlled in accordance with a program which is stored beforehand in a microcomputer (21), such as to attain a high speed and efficiency of operation. In addition, a hole clearing operation is conducted immediately after the punching so that the chip remaining in the punched through hole, if any, is forced out from the through hole by the same punch as that used in the punching.