公开(公告)号：EP0336266A3

公开(公告)日：1991-08-07

申请号：EP89105471

申请日：1989-03-28

申请人： HITACHI CHEMICAL CO., LTD.

发明人： HANAWA, AKINORI ,  YOKOTA, MITSUO ,  SHIMIZU, AKIRA ,  TANAKA, KAZUYUKI ,  YAMASHITA, YUKIHIKO

IPC分类号： C08F290/12 ,  C08F299/02 ,  C08G59/30 ,  C08G59/42 ,  C08L63/10 ,  H05K1/03 ,  C08F299/00 ,  C08L33/00 ,  H05K1/00

CPC分类号： H05K1/0326 ,  C08F290/126 ,  C08F299/026 ,  C08G59/30 ,  C08G59/4292 ,  C08L63/10 ,  C08L2666/04

摘要： A thermosetting resin composition comprising (A) a dibasic acid modified epoxy (meth)acrylate resin obtained by reacting a bromine-containing epoxy resin with a dibasic acid of 4 or more carbon atoms followed by further reacting with acrylic acid or methacrylic acid, (B) a thermosetting resin having an unsaturated group in its side chains, the unsaturated group being copolymerizable with the resin (A), and (C) a polymerizable monomer; and an electrical laminate produced by using the thermosetting resin composition are disclosed.
The electrical laminate excels in heat resistance, moisture resistance, and electrical properties and, as well, has a good punching quality.