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公开(公告)号：EP4326012A1
公开(公告)日：2024-02-21
申请号：EP23191420.1
申请日：2023-08-14
发明人： LEE, Yongduk , GUPTA, Ankit , KSHIRSAGAR, Parag M.
IPC分类号： H05K1/02 , H01L23/473 , H05K3/46
摘要： Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component (104). A lid (106) is mounted to the PCB, wherein the lid (106) defines a cooling path (108) therein extending in a coolant flow direction from an inlet end of the cooling path (108) to an outlet end of the cooling path (108).
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公开(公告)号：EP4102711A3
公开(公告)日：2022-12-21
申请号：EP22177814.5
申请日：2022-06-08
发明人： LEE, Yongduk , WU, Xin , KSHIRSAGAR, Parag M. , LIU, Bo
摘要： Systems and methods of operating for a smart power router (900a) for boosting and protection are provided. Aspects include a power router (900a) comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router (900a) in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router (900a) in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.
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公开(公告)号：EP4277101A1
公开(公告)日：2023-11-15
申请号：EP23172055.8
申请日：2023-05-08
发明人： LEE, Yongduk , GUPTA, Ankit , KSHIRSAGAR, Parag M.
摘要： A device can include a first circuit (101) configured to be exposed to a first environment, the first circuit (101) comprising one or more first transfer inductors (101a), and a second circuit (103) isolated from the first circuit (101) and configured to be exposed to a second environment, the second circuit (103) comprising one or more second transfer inductors (103a). The second environment can be a harsh environment. The first circuit (101) and the second circuit (103) can be wirelessly coupled via the one or more first transfer inductors (101a) and the one or more second transfer inductors (103a) to allow transfer of power and/or signals between the first circuit (101) and the second circuit.
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公开(公告)号：EP3598629A1
公开(公告)日：2020-01-22
申请号：EP19186836.3
申请日：2019-07-17
发明人： KSHIRSAGAR, Parag M.
摘要： The embodiments include a method for operating and a circuit for H-type multilevel power converter. The embodiments include power supply voltage rails and a neutral point (N), and a DC link capacitor (204) coupled to the power supply voltage rails. Also the embodiments include an H-bridge switching network (206), wherein the H-bridge switching network (206) is coupled to the power supply voltage rails, the neutral point and an output inverter stage, and the output inverter stage, wherein the output inverter stage comprises one or more pairs of switches that are coupled to an output phase and are configured to operate in a complementary mode.
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公开(公告)号：EP4297079A1
公开(公告)日：2023-12-27
申请号：EP23180459.2
申请日：2023-06-20
发明人： LEE, Jin , LEE, Yongduk , KSHIRSAGAR, Parag M.
IPC分类号： H01L23/367 , H01L23/473 , H05K7/20
摘要： The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips (14) that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant (31) flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.
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公开(公告)号：EP4102678A1
公开(公告)日：2022-12-14
申请号：EP22172315.8
申请日：2022-05-09
发明人： LEE, Yongduk , WU, Xin , LIU, Bo , KSHIRSAGAR, Parag M.
摘要： Systems for a current limiting circuit are provided. Aspects include a first set of batteries coupled to a battery terminal (402), a power converter (410) coupled to a power converter terminal (402-1), wherein the battery terminal (402) is coupled to the power converter terminal (402-1), a first current limiting circuit in series with the first set of batteries, wherein the current limiting circuit comprises a first circuit comprising a first transistor in series with a first diode, a second circuit comprising a second transistor in series with a second diode, a first RL circuit, wherein the first RL circuit, the first circuit, and the second circuit are arranged in parallel, a controller (480) configured to operate the first current limiter in a plurality of modes including a battery discharge mode including the controller operating the first transistor in an off state, and operating the second transistor in a switching state.
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公开(公告)号：EP3193141B1
公开(公告)日：2018-08-29
申请号：EP16198514.8
申请日：2016-11-11
CPC分类号： B64C13/28 , G01D5/145 , G01D5/147 , G01D5/2013
摘要： An electromechanical actuator (30) includes a ground arm (46), an output arm (48) rotatable about an axis of rotation (16) relative to the ground arm and a position sensing arrangement to determine an angular position of the output arm (48) relative to the ground arm (46). The position sensing arrangement includes a position sensor fixed at the ground arm. The position sensor is configured to sense magnetic reluctance. A sensed portion (64) is located at the output arm (48) proximate to the position sensor. The sensed portion (64) includes a geometric variation (78, 82) in an output arm surface (62) configured to vary a magnetic reluctance sensed at the position sensor as a function of angular position of the output arm (48) relative to the ground arm (46).
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公开(公告)号：EP3193141A1
公开(公告)日：2017-07-19
申请号：EP16198514.8
申请日：2016-11-11
CPC分类号： B64C13/28 , G01D5/145 , G01D5/147 , G01D5/2013
摘要： An electromechanical actuator (30) includes a ground arm (46), an output arm (48) rotatable about an axis of rotation (16) relative to the ground arm and a position sensing arrangement to determine an angular position of the output arm (48) relative to the ground arm (46). The position sensing arrangement includes a position sensor fixed at the ground arm. The position sensor is configured to sense magnetic reluctance. A sensed portion (64) is located at the output arm (48) proximate to the position sensor. The sensed portion (64) includes a geometric variation (78, 82) in an output arm surface (62) configured to vary a magnetic reluctance sensed at the position sensor as a function of angular position of the output arm (48) relative to the ground arm (46).
摘要翻译： 机电致动器（30）包括接地臂（46），可相对于接地臂围绕旋转轴线（16）旋转的输出臂（48）和用于确定输出臂（48）的角位置的位置感测装置 ）相对于地面臂（46）。 位置感测装置包括固定在接地臂处的位置传感器。 位置传感器被配置为感测磁阻。 感测部分（64）位于靠近位置传感器的输出臂（48）处。 感测部分（64）包括在输出臂表面（62）中的几何变化（78,82），该输出臂表面（62）被配置为根据输出臂（48）相对于输出臂（48）的角位置改变在位置传感器处感测的磁阻 接地臂（46）。
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公开(公告)号：EP4350250A1
公开(公告)日：2024-04-10
申请号：EP23189593.9
申请日：2023-08-03
摘要： A cryocooler device (200) including a cryocooler (205) including an input and an output, the input forming a cooling path (400), and a first stage that cools a working fluid in the cooling path (400). At least one thermal energy storage device selectively connectable to the cooling path (400) and the cooling loop (300; 340), wherein in a first operational mode of the cryocooler device (200) where the at least one thermal energy storage device is connected to the cooling loop (300; 340) where the heat to be removed at the input exceeds a cooling capacity of the cryocooler device (200), and a second operational mode where the at least one thermal energy storage device is connected to the cooling path (400) where the heat to be removed is less than the cooling capacity of the cryocooler (205) and the heat is removed from the at least one thermal energy storage device.
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公开(公告)号：EP4102711A2
公开(公告)日：2022-12-14
申请号：EP22177814.5
申请日：2022-06-08
发明人： LEE, Yongduk , WU, Xin , KSHIRSAGAR, Parag M. , LIU, Bo
摘要： Systems and methods of operating for a smart power router (900a) for boosting and protection are provided. Aspects include a power router (900a) comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router (900a) in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router (900a) in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.
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