摘要:
Hot melt adhesive consisting of a core of a pressure sensitive adhesive comprising at least one polymer selected from polyester, polyacrylate, polyolefin, polyurethane, ethylene vinyl acetate polymers, styrene blockcopolymers or mixtures, at least one tackifier and optionally additives, the core material has a softening point of 80 to 150 °C and a tacky surface at 25°C, the hot melt adhesive having the form of pellets, each pellet of adhesive has an outer shell of a film forming material, whereby i) the film forming material is a thermoplastic polymer with a melting point of less than 120 °C, ii) each pellet being completely surrounded by the film material, iii) the film is applied as continuous film so that the pellets have a non-blocking surface and are free flowing at a temperature of less then 45°C. Such pellets can be used as feed for automated feeder devices for the supply hot melt application systems.
摘要:
The invention relates to a storage-stable hot-melt adhesive containing 15 to 70 wt% of a mixture of at least one copolymer based on ethylene and/or propylene and at least one C4 to C20 α-olefin, which can be obtained as a block copolymer by metallocene-catalyzed polymerization, and at least one styrene block copolymer, 10 to 70 wt% of at least one tackifying resin, and 0 to 40 wt% of additional additives, wherein the sum of the % shares should equal 100% and the tackifying resin is completely or partially a soft resin.
摘要:
Melt adhesive for re-sealable packages containing 30 to 90% by weight of at least one copolymer based on ethylene and/or propylene together with C4 to C12 α-olefins, which is obtainable by a metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 minutes (DIN ISO 1133), 5 to 50% by weight of tackifying resins with a softening point of 80° to 140°C, 0 to 15% by weight of waxes with a melting point of 120° to 170°C, 0.1 to 20% by weight of additives and auxiliary materials, wherein the adhesive has a viscosity of 25,000 mPas to 250,000 mPas, measured at a temperature of 170° to 190°C.
摘要翻译:用于可再密封包装的熔融粘合剂,其包含30-90重量%的至少一种基于乙烯和/或丙烯与C4-C12α-烯烃的共聚物,其可通过茂金属催化的聚合获得,熔体指数为 5至100克/ 10分钟(DIN ISO 1133),5至50重量%的软化点为80至140℃的增粘树脂,0至15重量%的熔点为120至 170℃,0.1至20重量%的添加剂和辅助材料,其中所述粘合剂在170℃至190℃的温度下测量的粘度为25,000mPas至250,000mPas。
摘要:
The invention relates to a hotmelt adhesive comprising 10 to 40 wt% of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200°C under a test load of 5 kg; 0 to 40 wt% of at least one styrene polymer or styrene copolymer; 20 to 60 wt% of at least one tackifying resin; 0 to 15 wt% of at least one plasticizer; and 0 to 16 wt% of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.
摘要:
Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C 3 to C 20 -α-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100 %, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0°C to 25°C, measured as the ratio of the storage modulus E' according to (E' 0C - E' 25C ) / E' 25C
摘要:
The hot melt pressure-sensitive adhesive (PSA) in the form of a granulate, the granulate comprises a core made of a hot melt pressure-sensitive adhesive and an outer layer, surrounding said core, made of a composition that is not pressure-sensitively adhesive, where the outer layer contains: 5 to 35 wt % of a hydrogenated styrene block copolymer; 20 to 65 wt % of at least one oil; and 0 to 15 wt % additives.
摘要:
Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C3 to C20 -a-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100 %, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0°C to 25°C, measured as the ratio of the storage modulus E' according to (E'0C - E'25C ) / E'25C