公开(公告)号：EP2914660B1

公开(公告)日：2019-07-24

申请号：EP13850880.9

申请日：2013-10-23

申请人： Henkel IP & Holding GmbH

发明人： CAIN, Cynthia L. ,  PAUL, Charles W. ,  DEJESUS, Maria Cristina Barbosa

IPC分类号： C08L33/04 ,  C08L101/00 ,  C08K5/34 ,  C08J5/00 ,  B29C45/00 ,  B29C45/14 ,  B29C33/12 ,  C08L53/00 ,  B32B27/30 ,  B29L31/34 ,  B29K33/04 ,  B29K33/00

公开(公告)号：EP2914660A1

公开(公告)日：2015-09-09

申请号：EP13850880.9

申请日：2013-10-23

申请人： Henkel IP & Holding GmbH

发明人： CAIN, Cynthia L. ,  PAUL, Charles W. ,  DEJESUS, Maria Cristina Barbosa

IPC分类号： C08L33/04 ,  C08L101/00 ,  C08L33/12 ,  C08K5/3475 ,  C08J5/00

CPC分类号： B29C45/14 ,  B29C33/12 ,  B29C45/0001 ,  B29C45/14065 ,  B29C45/14639 ,  B29K2033/04 ,  B29K2033/08 ,  B29K2033/12 ,  B29L2031/34 ,  B32B27/308 ,  C08L53/00 ,  Y10T428/23

摘要： The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C.