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公开(公告)号：EP3161094B1
公开(公告)日：2019-02-13
申请号：EP14895595.8
申请日：2014-06-24
发明人： HYNES, Stephen , SUN, Chunyu , OUYANG, Jiangbo , WOODS, John Gregory , ISSARI, Bahram , KONG, Shengqian , LIU, Yayun , ZHANG, Wenhua
IPC分类号： C09J183/07 , C09J183/14 , C08G77/50
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公开(公告)号：EP3161094A1
公开(公告)日：2017-05-03
申请号：EP14895595.8
申请日：2014-06-24
发明人： HYNES, Stephen , SUN, Chunyu , OUYANG, Jiangbo , WOODS, John Gregory , ISSARI, Bahram , KONG, Shengqian , LIU, Yayun , ZHANG, Wenhua
IPC分类号： C09J183/07 , C09J183/14 , C08G77/50
CPC分类号： C09J183/14 , C08G77/12 , C08G77/20 , C08G77/50 , C08G77/52 , C08K3/36 , C08K5/0025 , C08K5/07 , C08K5/56 , C08L83/00 , C09J5/06 , C09J183/04 , C09J2205/302 , C09J2205/31 , C09J2483/00 , H01L21/6835 , H01L27/1259
摘要： The present invention relates to one-component UV and thermal curable temporary adhesives for use in high temperature applications, and particularly to adhesives for the temporary attachment of one substrate to another substrate, the adhesives comprising (i) the partial hydrosilylation reaction product of the reaction between the vinyl groups on 1,3,5,7-tetravinyl-1,3,5,7-tetramethylcyclotetrasiloxane and the terminal Si—H hydrogens on a silane or siloxane having terminal Si—H hydrogens, and (ii) a photo and/or thermal radical cure initiator. Also encompassed are assemblies including such an adhesive and methods of using the adhesives.
摘要翻译： 本发明涉及用于高温应用的单组分UV和热固化临时粘合剂，并且特别涉及用于将一个基底临时粘合到另一个基底的粘合剂，所述粘合剂包含（i）反应的部分氢化硅烷化反应产物 在具有末端Si-H氢的硅烷或硅氧烷上的1,3,5,7-四乙烯基-1,3,5,7-四甲基环四硅氧烷上的乙烯基与末端Si-H氢之间，和（ii）光和 /或热自由基固化引发剂。 还包括包含这种粘合剂的组件和使用粘合剂的方法。
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3.发明授权
公开(公告)号：EP3452534B1
公开(公告)日：2020-12-02
申请号：EP17793229.0
申请日：2017-05-03
发明人： ISSARI, Bahram , ZHANG, Wenhua , WOODS, John G. , KONG, Shengqian , LIU, Yayun , OUYANG, Jiangbo , KANG, Li
IPC分类号： C08G77/24 , C09J183/08 , C09J9/00
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公开(公告)号：EP2640791B1
公开(公告)日：2020-04-22
申请号：EP11842029.8
申请日：2011-11-21
IPC分类号： C09J11/00 , C09J201/00 , C09J131/04
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5.发明公开
公开(公告)号：EP3452534A1
公开(公告)日：2019-03-13
申请号：EP17793229.0
申请日：2017-05-03
发明人： ISSARI, Bahram , ZHANG, Wenhua , WOODS, John G. , KONG, Shengqian , LIU, Yayun , OUYANG, Jiangbo , KANG, Li
IPC分类号： C08G77/24 , C09J183/08 , C09J9/00
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公开(公告)号：EP4444816A1
公开(公告)日：2024-10-16
申请号：EP22905238.6
申请日：2022-11-22
申请人： Henkel AG & Co. KGaA
发明人： LIU, Yayun
IPC分类号： C09J175/06 , C09J7/38 , C09J7/20 , C08L93/04 , C08L77/02
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7.发明公开COMPOSITION WITH THERMALLY-TREATED SILICA FILLER FOR PERFORMANCE ENHANCEMENT 审中-公开具有热处理的二氧化硅填料性能COMPOSITION
公开(公告)号：EP2084213A1
公开(公告)日：2009-08-05
申请号：EP07863777.4
申请日：2007-11-01
申请人： Henkel AG & Co. KGaA
发明人： DUFFY, Daniel , LIU, Yayun , XIAO, Allison, Yue
CPC分类号： C08K3/36
摘要： A curable composition comprising a curable resin and a thermally-treated silica filler, when used as an underfill material in semiconductor packages provides improved flow behavior, reduction in CTE, and enhancement of modulus, leading to reduced warpage. In one embodiment, the curable composition comprises (a) a thermally treated silica filler, (b) a curable resin (c) an initiator, and (d) optionally, adhesion promoters and/or wetting agents. The curable resins can be cyanate ester resins, epoxy resins, maleimide resins, or acrylate or methacrylate resins.
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