公开(公告)号：EP3360157A1

公开(公告)日：2018-08-15

申请号：EP16854003.7

申请日：2016-10-07

申请人： Heptagon Micro Optics Pte. Ltd.

发明人： BOJAN, Tesanovic ,  SPRING, Nicola ,  GUBSER, Simon ,  LENART, Robert ,  CESANA, Mario

IPC分类号： H01L21/76 ,  H05K3/28 ,  H01L21/56 ,  H01L21/31 ,  H01L21/469 ,  H01L27/14

摘要： Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

公开(公告)号：EP3360157B1

公开(公告)日：2020-09-02

申请号：EP16854003.7

申请日：2016-10-07

申请人： Heptagon Micro Optics Pte. Ltd.

发明人： BOJAN, Tesanovic ,  SPRING, Nicola ,  GUBSER, Simon ,  LENART, Robert ,  CESANA, Mario

IPC分类号： H01L21/76 ,  H05K3/28 ,  H01L21/56 ,  H01L21/31 ,  H01L21/469 ,  H01L27/14 ,  H01L33/48 ,  H01L33/62 ,  H01L33/58