公开(公告)号：EP3183745B1

公开(公告)日：2019-11-13

申请号：EP15833195.9

申请日：2015-08-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： RUDMANN, Hartmut ,  CESANA, Mario ,  GEIGER, Jens ,  ROENTGEN, Peter ,  CONDORELLI, Vincenzo

IPC: H01L21/70 ,  H01L27/00 ,  G02B7/02 ,  H01L27/146

公开(公告)号：EP2914997B1

公开(公告)日：2018-10-03

申请号：EP13851620.8

申请日：2013-10-31

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： HEIMGARTNER, Stephan ,  KETTUNEN, Ville ,  SPRING, Nicola ,  BIETSCH, Alexander ,  CESANA, Mario ,  RUDMANN, Hartmut ,  ALASIRNIO, Jukka ,  LENART, Robert

IPC: G02B13/00 ,  H01L31/0232 ,  H04N5/225 ,  H01L31/0216 ,  H01L27/146

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：EP3360157A1

公开(公告)日：2018-08-15

申请号：EP16854003.7

申请日：2016-10-07

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： BOJAN, Tesanovic ,  SPRING, Nicola ,  GUBSER, Simon ,  LENART, Robert ,  CESANA, Mario

IPC: H01L21/76 ,  H05K3/28 ,  H01L21/56 ,  H01L21/31 ,  H01L21/469 ,  H01L27/14

Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

公开(公告)号：EP3417486A1

公开(公告)日：2018-12-26

申请号：EP17753598.6

申请日：2017-02-17

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： CAMARRI, Camilla ,  CESANA, Mario ,  RUDMANN, Hartmut

IPC: H01L31/00 ,  H01L51/44 ,  H01L23/28 ,  H01L33/52 ,  H01L25/16 ,  G01S7/481

CPC classification number: G01S7/4814 ,  G01S7/4813 ,  G01S7/4816 ,  H01L25/16 ,  H01L25/165 ,  H01L25/167 ,  H01L31/00 ,  H01L31/0203 ,  H01L31/12 ,  H01L51/44

Abstract: An optoelectronic module includes first and second optical channels having respective active optoelectronic components. A transparent encapsulation is over the active optoelectronic components, and opaque encapsulation is on the transparent encapsulation. The opaque encapsulation has a first opening over a first active optoelectronic component and a second opening over a second optoelectronic component. The opaque encapsulation forms a ledge in an area of the second opening, and an optical assembly is disposed on the ledge within the second opening over the second optoelectronic component.

公开(公告)号：EP3360157B1

公开(公告)日：2020-09-02

申请号：EP16854003.7

申请日：2016-10-07

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： BOJAN, Tesanovic ,  SPRING, Nicola ,  GUBSER, Simon ,  LENART, Robert ,  CESANA, Mario

IPC: H01L21/76 ,  H05K3/28 ,  H01L21/56 ,  H01L21/31 ,  H01L21/469 ,  H01L27/14 ,  H01L33/48 ,  H01L33/62 ,  H01L33/58

公开(公告)号：EP3183745A1

公开(公告)日：2017-06-28

申请号：EP15833195.9

申请日：2015-08-18

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： RUDMANN, Hartmut ,  CESANA, Mario ,  GEIGER, Jens ,  ROENTGEN, Peter ,  CONDORELLI, Vincenzo

IPC: H01L21/70 ,  H01L27/00 ,  G02B7/02

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

Abstract translation: 光电子模块包括其中或上面有光电子器件的硅衬底。 光学组件布置在光电子器件上方，并且隔离物将硅衬底与光学组件分离。 还描述了制造这种模块的方法。

公开(公告)号：EP2914997A1

公开(公告)日：2015-09-09

申请号：EP13851620.8

申请日：2013-10-31

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： HEIMGARTNER, Stephan ,  KETTUNEN, Ville ,  SPRING, Nicola ,  BIETSCH, Alexander ,  CESANA, Mario ,  RUDMANN, Hartmut ,  ALASIRNIO, Jukka ,  LENART, Robert

IPC: G02B13/00 ,  G02B7/02 ,  H01L31/0232 ,  H04N5/225

CPC classification number: H01L27/14625 ,  G02B27/0025 ,  H01L27/14627 ,  H01L27/14685 ,  H01L27/14687 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02325 ,  H01L31/18 ,  H04N5/2254 ,  Y10T29/49826

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

Abstract translation: 制造光学器件可以包括将多个单独的透镜系统安装在衬底上，将衬底的厚度调整到至少一些透镜系统的下方，以为透镜系统提供相应的焦距校正，随后将衬底分离成多个 光学模块，每个光学模块包括安装在基板的一部分上的透镜系统之一。 调整衬底的厚度可以包括例如微加工衬底以在透镜系统的至少一些下面形成相应的孔，或者在透镜系统的至少一些之下添加一个或多个层，以便校正透镜系统中的变化 镜头系统的焦距。