公开(公告)号：EP3378096A1

公开(公告)日：2018-09-26

申请号：EP16866759.0

申请日：2016-11-15

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： YU, Qichuan ,  RUDMANN, Hartmut ,  WANG, Ji ,  NG, Kian Siang ,  GUBSER, Simon ,  EILERTSEN, James ,  GNANA SAMBANDAM, Sundar Raman

IPC: H01L23/29 ,  H01L21/56 ,  H01L21/58 ,  H01L21/782 ,  H01L21/82 ,  H01L23/31 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2224/97 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/005 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate, thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material.

公开(公告)号：EP3303992A1

公开(公告)日：2018-04-11

申请号：EP16803861.0

申请日：2016-05-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： GEIGER, Jens ,  ROENTGEN, Peter ,  ROSSI, Markus ,  EILERTSEN, James

IPC: G01C3/00 ,  G01B11/02 ,  G01S7/48 ,  G01S17/08

CPC classification number: G01S17/46 ,  G01S7/4813 ,  G01S7/4814 ,  G01S7/4815 ,  G01S17/08 ,  G01S17/36

Abstract: Various optoelectronic modules are described that include an emitter operable to produce light (e.g., electromagnetic radiation in the visible or non-visible ranges), an emitter optical assembly aligned with the emitter so as to illuminate an object outside the module with light produced by the emitter, a detector operable to detect light at one or more wavelengths produced by the emitter, and a detector optical assembly aligned with the detector so as to direct light reflected by the object toward the detector. In some implementations, the modules include features for expanding or shifting the linear photocurrent response of the detector.